Paper Abstract and Keywords |
Presentation |
2018-02-28 17:20
Evaluation of a Radiation-Hardened Method and Soft Error Resilience on Stacked Transistors in 28/65 nm FDSOI Processes Haruki Maruoka, Kodai Yamada, Mitsunori Ebara, Jun Furuta, Kazutoshi Kobayashi (KIT) VLD2017-103 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
The continuous downscaling of transistors has resulted in an increase of reliability issues for semiconductor chips. In this paper, we propose a radiation-hardened technique for stacked transistors. We evaluate their radiation hardness by TCAD simulations. Widening the distance between stacked transistors increase their radiation hardness from TCAD simulations. We fabricate three latches which have different distance between stacked transistors in 65 nm FDSOI process. Experimental results reveal that there is no error in stacked transistors widened the distance from 250 nm to 350 nm. We also evaluate the effect of downscaling on stacked transistors to compare with their radiation hardness in 28 nm and 65 nm FDSOI processes. The experimental results prove that stacked transistors are effective radiation-hardened technique for downscaled processes. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
soft error / flip-flop / FDSOI / heavy ion / TCAD simulation / / / |
Reference Info. |
IEICE Tech. Rep., vol. 117, no. 455, VLD2017-103, pp. 85-90, Feb. 2018. |
Paper # |
VLD2017-103 |
Date of Issue |
2018-02-21 (VLD) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
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VLD2017-103 |
Conference Information |
Committee |
VLD HWS |
Conference Date |
2018-02-28 - 2018-03-02 |
Place (in Japanese) |
(See Japanese page) |
Place (in English) |
Okinawa Seinen Kaikan |
Topics (in Japanese) |
(See Japanese page) |
Topics (in English) |
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Paper Information |
Registration To |
VLD |
Conference Code |
2018-02-VLD-HWS |
Language |
Japanese |
Title (in Japanese) |
(See Japanese page) |
Sub Title (in Japanese) |
(See Japanese page) |
Title (in English) |
Evaluation of a Radiation-Hardened Method and Soft Error Resilience on Stacked Transistors in 28/65 nm FDSOI Processes |
Sub Title (in English) |
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Keyword(1) |
soft error |
Keyword(2) |
flip-flop |
Keyword(3) |
FDSOI |
Keyword(4) |
heavy ion |
Keyword(5) |
TCAD simulation |
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1st Author's Name |
Haruki Maruoka |
1st Author's Affiliation |
Kyoto Institute of Technology University (KIT) |
2nd Author's Name |
Kodai Yamada |
2nd Author's Affiliation |
Kyoto Institute of Technology University (KIT) |
3rd Author's Name |
Mitsunori Ebara |
3rd Author's Affiliation |
Kyoto Institute of Technology University (KIT) |
4th Author's Name |
Jun Furuta |
4th Author's Affiliation |
Kyoto Institute of Technology University (KIT) |
5th Author's Name |
Kazutoshi Kobayashi |
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Kyoto Institute of Technology University (KIT) |
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Speaker |
Author-1 |
Date Time |
2018-02-28 17:20:00 |
Presentation Time |
25 minutes |
Registration for |
VLD |
Paper # |
VLD2017-103 |
Volume (vol) |
vol.117 |
Number (no) |
no.455 |
Page |
pp.85-90 |
#Pages |
6 |
Date of Issue |
2018-02-21 (VLD) |