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Paper Abstract and Keywords
Presentation 2018-02-28 15:50
Construction of simulation for analyzing thermal conduction in nanostructures
Naomi Yamashita, Yuya Ota, Ryo Nanao, Hiroshi Inokawa, Masaru Shimomura, Kenji Murakami, Hiroya Ikeda (Shizuoka Univ.) ED2017-112 SDM2017-112
Abstract (in Japanese) (See Japanese page) 
(in English) With the aim of characterizing the thermal conductivity for nanometer-scale thermoelectric materials, we have constructed a new measurement system based on ac calorimetry. Analysis of the obtained data requires time-evolution of temperature distribution in nanometer-scale material under periodic heating. In this study, we made a simulation using a C#-program for time-dependent temperature distribution, based on 2-dimensional heat-diffusion equation including the influence of heat emission from material edges. The simulation was applied to AlN with millimeter-scale dimensions for confirming the validity and accuracy. The simulated thermal diffusivity for 10$times$75-mm$^{2}$-area AlN was 1.3x10^-4 m^2/s, which was larger than the value set in the heat-diffusion equation. This overestimation was also observed in the experiment. Therefore, our simulation can reproduce the unsteady heat conduction and be used for analyzing the ac calorimetry experiment.
Keyword (in Japanese) (See Japanese page) 
(in English) thermal diffusivity / ac calorimetry / heat diffusion equation / AlN / / / /  
Reference Info. IEICE Tech. Rep., vol. 117, no. 454, SDM2017-112, pp. 35-38, Feb. 2018.
Paper # SDM2017-112 
Date of Issue 2018-02-21 (ED, SDM) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF ED2017-112 SDM2017-112

Conference Information
Committee ED SDM  
Conference Date 2018-02-28 - 2018-02-28 
Place (in Japanese) (See Japanese page) 
Place (in English) Centennial Hall, Hokkaido Univ. 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Functional nanodevices and related technologies 
Paper Information
Registration To SDM 
Conference Code 2018-02-ED-SDM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Construction of simulation for analyzing thermal conduction in nanostructures 
Sub Title (in English)  
Keyword(1) thermal diffusivity  
Keyword(2) ac calorimetry  
Keyword(3) heat diffusion equation  
Keyword(4) AlN  
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1st Author's Name Naomi Yamashita  
1st Author's Affiliation Shizuoka University (Shizuoka Univ.)
2nd Author's Name Yuya Ota  
2nd Author's Affiliation Shizuoka University (Shizuoka Univ.)
3rd Author's Name Ryo Nanao  
3rd Author's Affiliation Shizuoka University (Shizuoka Univ.)
4th Author's Name Hiroshi Inokawa  
4th Author's Affiliation Shizuoka University (Shizuoka Univ.)
5th Author's Name Masaru Shimomura  
5th Author's Affiliation Shizuoka University (Shizuoka Univ.)
6th Author's Name Kenji Murakami  
6th Author's Affiliation Shizuoka University (Shizuoka Univ.)
7th Author's Name Hiroya Ikeda  
7th Author's Affiliation Shizuoka University (Shizuoka Univ.)
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Speaker Author-7 
Date Time 2018-02-28 15:50:00 
Presentation Time 25 minutes 
Registration for SDM 
Paper # ED2017-112, SDM2017-112 
Volume (vol) vol.117 
Number (no) no.453(ED), no.454(SDM) 
Page pp.35-38 
#Pages 4 
Date of Issue 2018-02-21 (ED, SDM) 

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