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Paper Abstract and Keywords
Presentation 2019-02-07 11:25
[Invited Talk] Ultrafine 3D Interconnect Technology Using Directed Self-Assembly
Takafumi Fukushima, Murugesan Mariappan, Mitsumasa Koyanagi (Tohoku Univ.) SDM2018-92
Abstract (in Japanese) (See Japanese page) 
(in English) A directed self-assembly (DSA) technology is applied to fabricate ultrafine pitch TSV (Through-Silicon Vias) for ultra-high density 3D storage memory systems. In addition, 3D chip bonding with fine-pitch Cu electrodes is also demonstrated. A nanocomposite consisting of an AB diblock copolymer and metal compounds/nanoparticles shows nano-cylinder structures on Si substrates based on a Flory-Huggins theory to interconnect between thin chips three-dimensionally stacked in layers.
Keyword (in Japanese) (See Japanese page) 
(in English) Directed Self-Assembly (DSA) / Through-Silicon Via (TSV) / Fine-Pitch Electrode Bonding / 3D-Stacked LSI / / / /  
Reference Info. IEICE Tech. Rep., vol. 118, no. 438, SDM2018-92, pp. 5-8, Feb. 2019.
Paper # SDM2018-92 
Date of Issue 2019-01-31 (SDM) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF SDM2018-92

Conference Information
Committee SDM  
Conference Date 2019-02-07 - 2019-02-07 
Place (in Japanese) (See Japanese page) 
Place (in English)  
Topics (in Japanese) (See Japanese page) 
Topics (in English) Backend / Assembly and Related materials technology 
Paper Information
Registration To SDM 
Conference Code 2019-02-SDM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Ultrafine 3D Interconnect Technology Using Directed Self-Assembly 
Sub Title (in English)  
Keyword(1) Directed Self-Assembly (DSA)  
Keyword(2) Through-Silicon Via (TSV)  
Keyword(3) Fine-Pitch Electrode Bonding  
Keyword(4) 3D-Stacked LSI  
Keyword(5)  
Keyword(6)  
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1st Author's Name Takafumi Fukushima  
1st Author's Affiliation Tohoku University (Tohoku Univ.)
2nd Author's Name Murugesan Mariappan  
2nd Author's Affiliation Tohoku University (Tohoku Univ.)
3rd Author's Name Mitsumasa Koyanagi  
3rd Author's Affiliation Tohoku University (Tohoku Univ.)
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Speaker Author-2 
Date Time 2019-02-07 11:25:00 
Presentation Time 40 minutes 
Registration for SDM 
Paper # SDM2018-92 
Volume (vol) vol.118 
Number (no) no.438 
Page pp.5-8 
#Pages 4 
Date of Issue 2019-01-31 (SDM) 

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