IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2019-08-22 13:30
Development of chipless sensor with moisture detection function for infrastructure
Takao Michisaka, Natsuki Komoda, Masatoshi Kondo (TF) AP2019-58
Abstract (in Japanese) (See Japanese page) 
(in English) Monitoring using sensors is being led by the government to address the problem of aging infrastructure. There are various methods for sensing but the durability of general infrastructures and buildings have already exceeded 30 years which makes it difficult to cope with the issue. As one of the solutions we focused on the technology of "chipless sensor" that is composed only of metal patterns without using electronic parts such as IC chips. This report describes a sensor that can detect moisture only with metal patterns by supplying power from the reader.
Keyword (in Japanese) (See Japanese page) 
(in English) infrastructure monitoring / chipless sensor / / / / / /  
Reference Info. IEICE Tech. Rep., vol. 119, no. 168, AP2019-58, pp. 61-64, Aug. 2019.
Paper # AP2019-58 
Date of Issue 2019-08-14 (AP) 
ISSN Online edition: ISSN 2432-6380
Copyright
and
reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF AP2019-58

Conference Information
Committee AP  
Conference Date 2019-08-21 - 2019-08-23 
Place (in Japanese) (See Japanese page) 
Place (in English) Hokkai-Gakuen Univ. 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Antennas and Propagation 
Paper Information
Registration To AP 
Conference Code 2019-08-AP 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Development of chipless sensor with moisture detection function for infrastructure 
Sub Title (in English)  
Keyword(1) infrastructure monitoring  
Keyword(2) chipless sensor  
Keyword(3)  
Keyword(4)  
Keyword(5)  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Takao Michisaka  
1st Author's Affiliation Toppan Forms Co., Ltd. (TF)
2nd Author's Name Natsuki Komoda  
2nd Author's Affiliation Toppan Forms Co., Ltd. (TF)
3rd Author's Name Masatoshi Kondo  
3rd Author's Affiliation Toppan Forms Co., Ltd. (TF)
4th Author's Name  
4th Author's Affiliation ()
5th Author's Name  
5th Author's Affiliation ()
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
Speaker Author-1 
Date Time 2019-08-22 13:30:00 
Presentation Time 25 minutes 
Registration for AP 
Paper # AP2019-58 
Volume (vol) vol.119 
Number (no) no.168 
Page pp.61-64 
#Pages
Date of Issue 2019-08-14 (AP) 


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan