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Paper Abstract and Keywords
Presentation 2019-10-25 16:35
Analysis of Crosstalk Between Lines on Printed Circuit Board with 3 Layers
Teruo Tobana, Yoji Isota, Masashi Kawakami, Akimoto Kohei (Akita Pref. Univ.) EMCJ2019-69 MW2019-98 EST2019-77
Abstract (in Japanese) (See Japanese page) 
(in English) Recently, by advance of miniaturization of electronic devices, a ground of a printed circuit board is tend to be small and complicated and the ground may have some defects, such as connectors or clearance halls of vias. In this paper, we calculated electromagnetic coupling between microstrip lines on different layers in 3 layers printed circuit board with a narrow ground slot which has finite length using multi-conductor transmission lines method. In order to calculate some electromagnetic coupling, per-unit-length parameters between the slot and the microstrip line are calculated using the spectral domain method. Finally, we showed that near-end electromagnetic coupling results using MTL method agree as a trend with the FDTD method results and measured results but far-end coupling results do not agree.
Keyword (in Japanese) (See Japanese page) 
(in English) coupling / multiconductor-transmission-line / ground slot / 3 layers PCB / / / /  
Reference Info. IEICE Tech. Rep., vol. 119, no. 241, EMCJ2019-69, pp. 183-186, Oct. 2019.
Paper # EMCJ2019-69 
Date of Issue 2019-10-17 (EMCJ, MW, EST) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMCJ2019-69 MW2019-98 EST2019-77

Conference Information
Committee EMCJ MW EST IEE-EMC  
Conference Date 2019-10-24 - 2019-10-25 
Place (in Japanese) (See Japanese page) 
Place (in English) Tohoku Gakuin University(Conf. Room 2, Eng. Bldg. 1) 
Topics (in Japanese) (See Japanese page) 
Topics (in English) EMC, Microwave, Electromagnetic field simulation. 
Paper Information
Registration To EMCJ 
Conference Code 2019-10-EMCJ-MW-EST-EMC 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Analysis of Crosstalk Between Lines on Printed Circuit Board with 3 Layers 
Sub Title (in English)  
Keyword(1) coupling  
Keyword(2) multiconductor-transmission-line  
Keyword(3) ground slot  
Keyword(4) 3 layers PCB  
Keyword(5)  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Teruo Tobana  
1st Author's Affiliation Akita Prefectural University (Akita Pref. Univ.)
2nd Author's Name Yoji Isota  
2nd Author's Affiliation Akita Prefectural University (Akita Pref. Univ.)
3rd Author's Name Masashi Kawakami  
3rd Author's Affiliation Akita Prefectural University (Akita Pref. Univ.)
4th Author's Name Akimoto Kohei  
4th Author's Affiliation Akita Prefectural University (Akita Pref. Univ.)
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Speaker Author-1 
Date Time 2019-10-25 16:35:00 
Presentation Time 20 minutes 
Registration for EMCJ 
Paper # EMCJ2019-69, MW2019-98, EST2019-77 
Volume (vol) vol.119 
Number (no) no.241(EMCJ), no.242(MW), no.243(EST) 
Page pp.183-186 
#Pages 4 
Date of Issue 2019-10-17 (EMCJ, MW, EST) 

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