| Paper Abstract and Keywords |
| Presentation |
2020-10-22 14:50
Modification of states of copper and copper oxide due to IPA treatment Takezo Mawaki (Tohoku Univ.), Akinobu Teramoto (Hiroshima Univ.), Katsutoshi Ishii (Tokyo Electron Technology Solutions), Yoshinobu Shiba, Tomoyuki Suwa (Tohoku Univ.), Shuji Azumo, Akira Shimizu, Kota Umezawa (Tokyo Electron Technology Solutions), Rihito Kuroda, Yasuyuki Shirai, Shigetoshi Sugawa (Tohoku Univ.) SDM2020-19 |
| Abstract |
(in Japanese) |
(See Japanese page) |
| (in English) |
The reduction of copper oxide by isopropyl alcohol (IPA) gas and its mechanism were investigated toward the selective process of copper (Cu) wiring. Also the decomposition behavior of IPA gas during the IPA treatment on Cu and copper oxide surfaces was studied. The decomposition and reaction behaviors and adsorption characteristics of IPA were investigated by the Fourier transform infrared spectroscopy (FT-IR). The chemical structures of the Cu and copper oxide surfaces before and after IPA treatment were analyzed by X-ray photoelectron spectroscopy (XPS). Based on the experiments, the process condition to induce reduction of copper oxide by IPA gas within the Cu processes temperature range was identified. Also, the decomposition behavior of IPA gas on Cu and copper oxide surfaces was clarified. |
| Keyword |
(in Japanese) |
(See Japanese page) |
| (in English) |
IPA / Cu / AS-ALD / SAM / FT-IR / XPS / Reduction / |
| Reference Info. |
IEICE Tech. Rep., vol. 120, no. 205, SDM2020-19, pp. 25-29, Oct. 2020. |
| Paper # |
SDM2020-19 |
| Date of Issue |
2020-10-15 (SDM) |
| ISSN |
Online edition: ISSN 2432-6380 |
Copyright and reproduction |
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SDM2020-19 |