Information: Join today and make your research activities more affordable! Technical workshop participation fees and annual registration fees are available at member rates.
Notice: [Important] Announcement of Changes to Registration Fee Payment and Manuscript Upload Procedures for IEICE Technical Meetings
IEICE Technical Committee Submission System
Conference Paper's Information		 Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2021-02-05 14:25
[Invited Talk] Impacts of Misalignment on 1um Pitch Cu-Cu Hybrid Bonding
Yoshihisa Kagawa, Takumi Kamibayashi, Masaki Haneda, Nobuotoshi Fujii, Syunsuke Furuse, Hideto Hashiguch, Tomoyuki Hirano, Hayato Iwamoto (SSS) SDM2020-58
Abstract (in Japanese) (See Japanese page) 
(in English) In this study, we have successfully demonstrated the 1um pitch Cu-Cu hybrid bonding technology with remarkable electrical properties and reliabilities. 1um pitch is world's finest class and is 3 times smaller than the connection pitch of our conventional Cu-Cu hybrid bonding technology. Moreover, the impacts of misalignment between upper Cu pad and lower Cu pad on contact resistance, electro-migration (EM) performance, leakage current and breakdown voltage were also investigated in such ultra-fine Cu-Cu hybrid bonding system.
Keyword (in Japanese) (See Japanese page) 
(in English) Cu-Cu Hybrid Bonding / 1um-pitch / misalignment / electro migration / 3D Chip Stacking / / /  
Reference Info. IEICE Tech. Rep., vol. 120, no. 359, SDM2020-58, pp. 15-18, Feb. 2021.
Paper # SDM2020-58 
Date of Issue 2021-01-29 (SDM) 
ISSN Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF SDM2020-58

Conference Information
Committee SDM  
Conference Date 2021-02-05 - 2021-02-05 
Place (in Japanese) (See Japanese page) 
Place (in English) Online 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To SDM 
Conference Code 2021-02-SDM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Impacts of Misalignment on 1um Pitch Cu-Cu Hybrid Bonding 
Sub Title (in English)  
Keyword(1) Cu-Cu Hybrid Bonding  
Keyword(2) 1um-pitch  
Keyword(3) misalignment  
Keyword(4) electro migration  
Keyword(5) 3D Chip Stacking  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Yoshihisa Kagawa  
1st Author's Affiliation Sony Semiconductor Solutions (SSS)
2nd Author's Name Takumi Kamibayashi  
2nd Author's Affiliation Sony Semiconductor Solutions (SSS)
3rd Author's Name Masaki Haneda  
3rd Author's Affiliation Sony Semiconductor Solutions (SSS)
4th Author's Name Nobuotoshi Fujii  
4th Author's Affiliation Sony Semiconductor Solutions (SSS)
5th Author's Name Syunsuke Furuse  
5th Author's Affiliation Sony Semiconductor Solutions (SSS)
6th Author's Name Hideto Hashiguch  
6th Author's Affiliation Sony Semiconductor Solutions (SSS)
7th Author's Name Tomoyuki Hirano  
7th Author's Affiliation Sony Semiconductor Solutions (SSS)
8th Author's Name Hayato Iwamoto  
8th Author's Affiliation Sony Semiconductor Solutions (SSS)
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
21st Author's Name  
21st Author's Affiliation ()
22nd Author's Name  
22nd Author's Affiliation ()
23rd Author's Name  
23rd Author's Affiliation ()
24th Author's Name  
24th Author's Affiliation ()
25th Author's Name  
25th Author's Affiliation ()
26th Author's Name / /
26th Author's Affiliation ()
()
27th Author's Name / /
27th Author's Affiliation ()
()
28th Author's Name / /
28th Author's Affiliation ()
()
29th Author's Name / /
29th Author's Affiliation ()
()
30th Author's Name / /
30th Author's Affiliation ()
()
31st Author's Name / /
31st Author's Affiliation ()
()
32nd Author's Name / /
32nd Author's Affiliation ()
()
33rd Author's Name / /
33rd Author's Affiliation ()
()
34th Author's Name / /
34th Author's Affiliation ()
()
35th Author's Name / /
35th Author's Affiliation ()
()
36th Author's Name / /
36th Author's Affiliation ()
()
Speaker Author-1 
Date Time 2021-02-05 14:25:00 
Presentation Time 40 minutes 
Registration for SDM 
Paper # SDM2020-58 
Volume (vol) vol.120 
Number (no) no.359 
Page pp.15-18 
#Pages 4 
Date of Issue 2021-01-29 (SDM) 

[Return to Top Page]

[Return to IEICE Web Page]
The Institute of Electronics, Information and Communication Engineers (IEICE), Japan