Information: Join today and make your research activities more affordable! Technical workshop participation fees and annual registration fees are available at member rates.
Notice: [Important] Announcement of Changes to Registration Fee Payment and Manuscript Upload Procedures for IEICE Technical Meetings
IEICE Technical Committee Submission System
Conference Paper's Information		 Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2021-08-06 13:05
Development of high quality factor REBCO wire coil in high frequency range and its application to Wireless Power Transfer
Masahiro Okeda, Naoto Sekiya, Keita Sakuma (Univ of Yamanashi) SCE2021-1
Abstract (in Japanese) (See Japanese page) 
(in English) We proposed a new REBCO wire structure in order to realize a low loss in high frequency. However, because of the two REBCO wires were integrated by embedding them in the support material (Styrene foam) to construct the coil, the quality factor of the coil was significantly reduced due to the dielectric loss of the support material. To overcome these problem, we developed a low loss modified proposed wire in high frequency and achieve a quality factor coil using it. As a result, we clarified that the quality factor of the coil using the modified proposed wire was 14 times higher than that of the copper coil. Furthermore, we reported that the measured transfer efficiency of wireless power transfer system with the developed high quality factor coil was very high compared to the system with the copper coils.
Keyword (in Japanese) (See Japanese page) 
(in English) Wireless power transfer / Magnetic coupling / High temperature superconducting / High quality coil / / / /  
Reference Info. IEICE Tech. Rep., vol. 121, no. 137, SCE2021-1, pp. 1-4, Aug. 2021.
Paper # SCE2021-1 
Date of Issue 2021-07-30 (SCE) 
ISSN Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF SCE2021-1

Conference Information
Committee SCE  
Conference Date 2021-08-06 - 2021-08-06 
Place (in Japanese) (See Japanese page) 
Place (in English) Online 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To SCE 
Conference Code 2021-08-SCE 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Development of high quality factor REBCO wire coil in high frequency range and its application to Wireless Power Transfer 
Sub Title (in English)  
Keyword(1) Wireless power transfer  
Keyword(2) Magnetic coupling  
Keyword(3) High temperature superconducting  
Keyword(4) High quality coil  
Keyword(5)  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Masahiro Okeda  
1st Author's Affiliation University of Yamanashi (Univ of Yamanashi)
2nd Author's Name Naoto Sekiya  
2nd Author's Affiliation University of Yamanashi (Univ of Yamanashi)
3rd Author's Name Keita Sakuma  
3rd Author's Affiliation University of Yamanashi (Univ of Yamanashi)
4th Author's Name  
4th Author's Affiliation ()
5th Author's Name  
5th Author's Affiliation ()
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
21st Author's Name  
21st Author's Affiliation ()
22nd Author's Name  
22nd Author's Affiliation ()
23rd Author's Name  
23rd Author's Affiliation ()
24th Author's Name  
24th Author's Affiliation ()
25th Author's Name  
25th Author's Affiliation ()
26th Author's Name / /
26th Author's Affiliation ()
()
27th Author's Name / /
27th Author's Affiliation ()
()
28th Author's Name / /
28th Author's Affiliation ()
()
29th Author's Name / /
29th Author's Affiliation ()
()
30th Author's Name / /
30th Author's Affiliation ()
()
31st Author's Name / /
31st Author's Affiliation ()
()
32nd Author's Name / /
32nd Author's Affiliation ()
()
33rd Author's Name / /
33rd Author's Affiliation ()
()
34th Author's Name / /
34th Author's Affiliation ()
()
35th Author's Name / /
35th Author's Affiliation ()
()
36th Author's Name / /
36th Author's Affiliation ()
()
Speaker Author-1 
Date Time 2021-08-06 13:05:00 
Presentation Time 25 minutes 
Registration for SCE 
Paper # SCE2021-1 
Volume (vol) vol.121 
Number (no) no.137 
Page pp.1-4 
#Pages 4 
Date of Issue 2021-07-30 (SCE) 

[Return to Top Page]

[Return to IEICE Web Page]
The Institute of Electronics, Information and Communication Engineers (IEICE), Japan