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Paper Abstract and Keywords
Presentation 2022-03-04 09:40
130 GHz Band CMOS Amplifier with Miniaturized Interstage Circuit by Stacked Radial Stub
Taiki Machii, Mizuki Motoyoshi, Suguru Kameda, Noriharu Suematsu (Tohoku Univ.) MW2021-130 Link to ES Tech. Rep. Archives: MW2021-130
Abstract (in Japanese) (See Japanese page) 
(in English) Low-loss matching circuit and inter stage is an important issue since sufficient gain cannot be achieved with over-100 GHz CMOS amplifiers.
In the case of matching circuit with short stub, the short stub should be terminated to the ground.
Since the matching circuit is applied DC bias to operate the FET of amplifier, the ground should not be directly connected the ground (DC ground) but should be AC ground.
It has been reported that the use of the radial stub for AC GND can reduce the loss of matching circuits.
However, when this amplifier is used in multiple stages, the inter stage circuit becomes longer to avoid interference between huge radial stubs, which causes problems such as increased loss and multiple reflections.
In order to solve this problem, it is necessary to reduce the number of radial stubs.
A conventional method is to use a common matching circuit between the output of the front stage and the input of the back stage.
However, this method has some problems that the DC bias is common and the matching is narrow-banded.
In this paper, we propose a stacked radial stub in which two radial stubs are stacked.
As a result, the number of AC GND stubs does not decrease, and the inter stage circuit can be miniaturized.
After confirming the characteristics of the proposed stub by EM simulation, it was applied to a 3stage 130 GHz CMOS amplifier and demonstrated by fabrication.
Keyword (in Japanese) (See Japanese page) 
(in English) CMOS / Amplifiers / Radial stub / Millimeter-wave / RFICs / D-band / Miniaturization /  
Reference Info. IEICE Tech. Rep., vol. 121, no. 400, MW2021-130, pp. 105-110, March 2022.
Paper # MW2021-130 
Date of Issue 2022-02-24 (MW) 
ISSN Online edition: ISSN 2432-6380
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All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF MW2021-130 Link to ES Tech. Rep. Archives: MW2021-130

Conference Information
Committee MW  
Conference Date 2022-03-03 - 2022-03-04 
Place (in Japanese) (See Japanese page) 
Place (in English) Online 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Microwave, etc. 
Paper Information
Registration To MW 
Conference Code 2022-03-MW 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) 130 GHz Band CMOS Amplifier with Miniaturized Interstage Circuit by Stacked Radial Stub 
Sub Title (in English)  
Keyword(1) CMOS  
Keyword(2) Amplifiers  
Keyword(3) Radial stub  
Keyword(4) Millimeter-wave  
Keyword(5) RFICs  
Keyword(6) D-band  
Keyword(7) Miniaturization  
Keyword(8)  
1st Author's Name Taiki Machii  
1st Author's Affiliation Tohoku University (Tohoku Univ.)
2nd Author's Name Mizuki Motoyoshi  
2nd Author's Affiliation Tohoku University (Tohoku Univ.)
3rd Author's Name Suguru Kameda  
3rd Author's Affiliation Tohoku University (Tohoku Univ.)
4th Author's Name Noriharu Suematsu  
4th Author's Affiliation Tohoku University (Tohoku Univ.)
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Speaker Author-1 
Date Time 2022-03-04 09:40:00 
Presentation Time 20 minutes 
Registration for MW 
Paper # MW2021-130 
Volume (vol) vol.121 
Number (no) no.400 
Page pp.105-110 
#Pages
Date of Issue 2022-02-24 (MW) 


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