Information: Join today and make your research activities more affordable! Technical workshop participation fees and annual registration fees are available at member rates.
Notice: [Important] Announcement of Changes to Registration Fee Payment and Manuscript Upload Procedures for IEICE Technical Meetings
IEICE Technical Committee Submission System
Conference Paper's Information		 Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2022-09-14 15:15
Development of 28 GHz band down-converter module with antenna using polymer powder bed fusion and plating
Ryuichi Kobayashi, Kohei Fujiwara, Yuta Watanabe, Satoshi Kuwahara, Shota Takemura, Kohei Takizawa (TIRI) MW2022-68
Abstract (in Japanese) (See Japanese page) 
(in English) We developed a down-converter module with a standard gain horn antenna using polyamide-12 polymer powder bed fusion. The converter housing was electroless-plated with copper to give conductivity to the surface, and a frequency converter board with a 28 GHz band patch antenna was assembled to the housing to fabricate the down-converter module. Models with and without defect countermeasures implemented in the building of the housing were fabricated, and the performance of the modules was compared. The 28-GHz signal received from the module's horn antenna could be converted to a 1.15-GHz signal.
Keyword (in Japanese) (See Japanese page) 
(in English) powder bed fusion / electroless plating / 28GHz / horn antenna / 3D printing / / /  
Reference Info. IEICE Tech. Rep., vol. 122, no. 183, MW2022-68, pp. 1-6, Sept. 2022.
Paper # MW2022-68 
Date of Issue 2022-09-07 (MW) 
ISSN Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF MW2022-68

Conference Information
Committee AP MW  
Conference Date 2022-09-14 - 2022-09-16 
Place (in Japanese) (See Japanese page) 
Place (in English) The Museum of Art, EHIME 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Microwave, Millimeter wave 
Paper Information
Registration To MW 
Conference Code 2022-09-AP-MW 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Development of 28 GHz band down-converter module with antenna using polymer powder bed fusion and plating 
Sub Title (in English)  
Keyword(1) powder bed fusion  
Keyword(2) electroless plating  
Keyword(3) 28GHz  
Keyword(4) horn antenna  
Keyword(5) 3D printing  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Ryuichi Kobayashi  
1st Author's Affiliation Tokyo Metropolitan Industrial Technology Institute (TIRI)
2nd Author's Name Kohei Fujiwara  
2nd Author's Affiliation Tokyo Metropolitan Industrial Technology Institute (TIRI)
3rd Author's Name Yuta Watanabe  
3rd Author's Affiliation Tokyo Metropolitan Industrial Technology Institute (TIRI)
4th Author's Name Satoshi Kuwahara  
4th Author's Affiliation Tokyo Metropolitan Industrial Technology Institute (TIRI)
5th Author's Name Shota Takemura  
5th Author's Affiliation Tokyo Metropolitan Industrial Technology Institute (TIRI)
6th Author's Name Kohei Takizawa  
6th Author's Affiliation Tokyo Metropolitan Industrial Technology Institute (TIRI)
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
21st Author's Name  
21st Author's Affiliation ()
22nd Author's Name  
22nd Author's Affiliation ()
23rd Author's Name  
23rd Author's Affiliation ()
24th Author's Name  
24th Author's Affiliation ()
25th Author's Name  
25th Author's Affiliation ()
26th Author's Name / /
26th Author's Affiliation ()
()
27th Author's Name / /
27th Author's Affiliation ()
()
28th Author's Name / /
28th Author's Affiliation ()
()
29th Author's Name / /
29th Author's Affiliation ()
()
30th Author's Name / /
30th Author's Affiliation ()
()
31st Author's Name / /
31st Author's Affiliation ()
()
32nd Author's Name / /
32nd Author's Affiliation ()
()
33rd Author's Name / /
33rd Author's Affiliation ()
()
34th Author's Name / /
34th Author's Affiliation ()
()
35th Author's Name / /
35th Author's Affiliation ()
()
36th Author's Name / /
36th Author's Affiliation ()
()
Speaker Author-1 
Date Time 2022-09-14 15:15:00 
Presentation Time 25 minutes 
Registration for MW 
Paper # MW2022-68 
Volume (vol) vol.122 
Number (no) no.183 
Page pp.1-6 
#Pages 6 
Date of Issue 2022-09-07 (MW) 

[Return to Top Page]

[Return to IEICE Web Page]
The Institute of Electronics, Information and Communication Engineers (IEICE), Japan