IEICE Technical Committee Submission System
Conference Paper's Information
Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2023-05-18 15:10
A design method for miniaturized multiplexer based on a novel substrate integrated defect ground structure
Weiyu Zhou, Koji Wada (UEC), Kenichi Ohta (Bifröstec Inc.) MW2023-10
Abstract (in Japanese) (See Japanese page) 
(in English) This paper proposes a new structure based on a substrate integrated defect ground structure (SIDGS), and a miniaturized triplexer is constructed using this structure. The structure forms a triplexer with significantly smaller dimensions than in previous triplexer related literature. In addition, the structure has good design freedom and can be extended to any number of multiplexers. Furthermore, multiplexers using this structure guarantee sufficient in-band isolation. The triplexer design method using this structure is described and finally simulated, fabricated, and measured.
Keyword (in Japanese) (See Japanese page) 
(in English) Substrate integrated defected ground structure (SIDGS) / Band-pass filter (BPF) / Triplexer / Miniaturization / Multiplexer / / /  
Reference Info. IEICE Tech. Rep., vol. 123, no. 35, MW2023-10, pp. 6-11, May 2023.
Paper # MW2023-10 
Date of Issue 2023-05-11 (MW) 
ISSN Online edition: ISSN 2432-6380
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF MW2023-10

Conference Information
Committee MW  
Conference Date 2023-05-18 - 2023-05-19 
Place (in Japanese) (See Japanese page) 
Place (in English) Ritsumeikan University 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Microwave, etc. 
Paper Information
Registration To MW 
Conference Code 2023-05-MW 
Language English (Japanese title is available) 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) A design method for miniaturized multiplexer based on a novel substrate integrated defect ground structure 
Sub Title (in English)  
Keyword(1) Substrate integrated defected ground structure (SIDGS)  
Keyword(2) Band-pass filter (BPF)  
Keyword(3) Triplexer  
Keyword(4) Miniaturization  
Keyword(5) Multiplexer  
1st Author's Name Weiyu Zhou  
1st Author's Affiliation The university of electro-communications (UEC)
2nd Author's Name Koji Wada  
2nd Author's Affiliation The university of electro-communications (UEC)
3rd Author's Name Kenichi Ohta  
3rd Author's Affiliation Bifröstec Inc. (Bifröstec Inc.)
4th Author's Name  
4th Author's Affiliation ()
5th Author's Name  
5th Author's Affiliation ()
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
Speaker Author-1 
Date Time 2023-05-18 15:10:00 
Presentation Time 25 minutes 
Registration for MW 
Paper # MW2023-10 
Volume (vol) vol.123 
Number (no) no.35 
Page pp.6-11 
Date of Issue 2023-05-11 (MW) 

[Return to Top Page]

[Return to IEICE Web Page]

The Institute of Electronics, Information and Communication Engineers (IEICE), Japan