Information: Join today and make your research activities more affordable! Technical workshop participation fees and annual registration fees are available at member rates.
Notice: [Important] Announcement of Changes to Registration Fee Payment and Manuscript Upload Procedures for IEICE Technical Meetings
IEICE Technical Committee Submission System
Conference Paper's Information		 Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2023-08-21 15:30
Ultrasonic 3D imaging with distributed electrodes and a single transmitter/receiver circuit
Eiko Nakazawa, Mohammad Syaryadhi, Norio Tagawa (Tokyo Metropolitan Univ.) US2023-35
Abstract (in Japanese) (See Japanese page) 
(in English) Array probes with arrayed transducers are commonly used in ultrasound systems. This system is expensive due to the need for multiple transmitter and receiver circuits. In order to realise low-cost ultrasonic 3D imaging, this study proposes a sensor system with a single transmitter/receiver circuit. Electrodes are distributed over the surface of the transducer and randomly selected electrodes are connected to transmit and receive simultaneously, giving a different coding of the echoes from each position. This enables 3D imaging with a single transmitter/receiver circuit.In this study, the performance of this system is evaluated by simulation.
Keyword (in Japanese) (See Japanese page) 
(in English) 3D imaging / compression imaging / diffuse wave / / / / /  
Reference Info. IEICE Tech. Rep., vol. 123, no. 157, US2023-35, pp. 24-29, Aug. 2023.
Paper # US2023-35 
Date of Issue 2023-08-14 (US) 
ISSN Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF US2023-35

Conference Information
Committee US  
Conference Date 2023-08-21 - 2023-08-21 
Place (in Japanese) (See Japanese page) 
Place (in English) Tokyo Tech Front, Tokyo Tech (Ookayama Campus) 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Underwater acoustics, Ultrasonics, etc. 
Paper Information
Registration To US 
Conference Code 2023-08-US 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Ultrasonic 3D imaging with distributed electrodes and a single transmitter/receiver circuit 
Sub Title (in English)  
Keyword(1) 3D imaging  
Keyword(2) compression imaging  
Keyword(3) diffuse wave  
Keyword(4)  
Keyword(5)  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Eiko Nakazawa  
1st Author's Affiliation Tokyo Metropolitan University (Tokyo Metropolitan Univ.)
2nd Author's Name Mohammad Syaryadhi  
2nd Author's Affiliation Tokyo Metropolitan University (Tokyo Metropolitan Univ.)
3rd Author's Name Norio Tagawa  
3rd Author's Affiliation Tokyo Metropolitan University (Tokyo Metropolitan Univ.)
4th Author's Name  
4th Author's Affiliation ()
5th Author's Name  
5th Author's Affiliation ()
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
21st Author's Name  
21st Author's Affiliation ()
22nd Author's Name  
22nd Author's Affiliation ()
23rd Author's Name  
23rd Author's Affiliation ()
24th Author's Name  
24th Author's Affiliation ()
25th Author's Name  
25th Author's Affiliation ()
26th Author's Name / /
26th Author's Affiliation ()
()
27th Author's Name / /
27th Author's Affiliation ()
()
28th Author's Name / /
28th Author's Affiliation ()
()
29th Author's Name / /
29th Author's Affiliation ()
()
30th Author's Name / /
30th Author's Affiliation ()
()
31st Author's Name / /
31st Author's Affiliation ()
()
32nd Author's Name / /
32nd Author's Affiliation ()
()
33rd Author's Name / /
33rd Author's Affiliation ()
()
34th Author's Name / /
34th Author's Affiliation ()
()
35th Author's Name / /
35th Author's Affiliation ()
()
36th Author's Name / /
36th Author's Affiliation ()
()
Speaker Author-1 
Date Time 2023-08-21 15:30:00 
Presentation Time 25 minutes 
Registration for US 
Paper # US2023-35 
Volume (vol) vol.123 
Number (no) no.157 
Page pp.24-29 
#Pages 6 
Date of Issue 2023-08-14 (US) 

[Return to Top Page]

[Return to IEICE Web Page]
The Institute of Electronics, Information and Communication Engineers (IEICE), Japan