Information: Join today and make your research activities more affordable! Technical workshop participation fees and annual registration fees are available at member rates.
Notice: [Important] Announcement of Changes to Registration Fee Payment and Manuscript Upload Procedures for IEICE Technical Meetings
IEICE Technical Committee Submission System
Conference Paper's Information		 Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2025-07-04 13:50
Elasticity Analysis of Particle Assemblies Composed of Two Species of Particles by Ultrasonic Spectroscopy
Mayu Hiromoto, Yuki Tominaga, Tomohisa Norisuye (KIT) US2025-17
Abstract (in Japanese) (See Japanese page) 
(in English) The particle assembly called a supraball (SB) is utilized in various fields such as medicine, catalysts, and electrical materials by taking advantage of its large specific surface area. To evaluate their mechanical stability, we have previously attempted to characterize the elastic properties of SBs using ultrasonic scattering methods. Specifically, we have prepared assemblies of cross-linked polymethyl methacrylate (PMMA) particles and investigated the effects of temperature and solvent during preparation. In this study, we investigated particle assemblies composed of two types of particles with different stiffnesses (silica and PMMA particles) to clarify the roles of hard and soft particles. The results of analyzing mixed particle assemblies with various particle composition ratios revealed that SB composed solely of PMMA particles was actually stiffer than SB composed solely of silica particles. This behavior was confirmed to be consistent regardless of the size of the SB. Furthermore, the validity of the ultrasonic method was confirmed through indentation measurements.
Keyword (in Japanese) (See Japanese page) 
(in English) Ultrasound / Microparticle / Supraball / Supraparticle / / / /  
Reference Info. IEICE Tech. Rep., vol. 125, no. 97, US2025-17, pp. 9-13, July 2025.
Paper # US2025-17 
Date of Issue 2025-06-27 (US) 
ISSN Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF US2025-17

Conference Information
Committee US  
Conference Date 2025-07-04 - 2025-07-04 
Place (in Japanese) (See Japanese page) 
Place (in English) Meiji University Surugadai Campus 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Material characterization, Ultrasonics, etc. 
Paper Information
Registration To US 
Conference Code 2025-07-US 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Elasticity Analysis of Particle Assemblies Composed of Two Species of Particles by Ultrasonic Spectroscopy 
Sub Title (in English)  
Keyword(1) Ultrasound  
Keyword(2) Microparticle  
Keyword(3) Supraball  
Keyword(4) Supraparticle  
Keyword(5)  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Mayu Hiromoto  
1st Author's Affiliation Kyoto Institute of Technology (KIT)
2nd Author's Name Yuki Tominaga  
2nd Author's Affiliation Kyoto Institute of Technology (KIT)
3rd Author's Name Tomohisa Norisuye  
3rd Author's Affiliation Kyoto Institute of Technology (KIT)
4th Author's Name  
4th Author's Affiliation ()
5th Author's Name  
5th Author's Affiliation ()
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
21st Author's Name  
21st Author's Affiliation ()
22nd Author's Name  
22nd Author's Affiliation ()
23rd Author's Name  
23rd Author's Affiliation ()
24th Author's Name  
24th Author's Affiliation ()
25th Author's Name  
25th Author's Affiliation ()
26th Author's Name / /
26th Author's Affiliation ()
()
27th Author's Name / /
27th Author's Affiliation ()
()
28th Author's Name / /
28th Author's Affiliation ()
()
29th Author's Name / /
29th Author's Affiliation ()
()
30th Author's Name / /
30th Author's Affiliation ()
()
31st Author's Name / /
31st Author's Affiliation ()
()
32nd Author's Name / /
32nd Author's Affiliation ()
()
33rd Author's Name / /
33rd Author's Affiliation ()
()
34th Author's Name / /
34th Author's Affiliation ()
()
35th Author's Name / /
35th Author's Affiliation ()
()
36th Author's Name / /
36th Author's Affiliation ()
()
Speaker Author-1 
Date Time 2025-07-04 13:50:00 
Presentation Time 25 minutes 
Registration for US 
Paper # US2025-17 
Volume (vol) vol.125 
Number (no) no.97 
Page pp.9-13 
#Pages 5 
Date of Issue 2025-06-27 (US) 

[Return to Top Page]

[Return to IEICE Web Page]
The Institute of Electronics, Information and Communication Engineers (IEICE), Japan