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Paper Abstract and Keywords
Presentation 2025-11-20 10:30
Temperature Characterization of Vertical GaN Devices on Silicon Substrates
Ryoya Aono, Shoma Nakashima, Tatsuya Kondo, Toshiharu Kubo, Takashi Egawa (Nagoya Inst. of Tech.) ED2025-23 CPM2025-51 LQE2025-47
Abstract (in Japanese) (See Japanese page) 
(in English) We have been developing AlGaN/GaN Current Aperture Vertical Electron Transistors (CAVETs), a type of vertical GaN-based transistor, using a high-resistivity strained layer superlattice (SLS) as the current blocking layer (CBL) instead of p-GaN to overcome the issues associated with p-GaN. The use of SLS enables an improvement in the maximum drain current density (IDSmax) and a reduction in drain leakage current compared with devices employing p-GaN. To further reduce the current barrier in the conductive SLS buffer layer on a Si substrate, Si $delta$-doping was introduced into the AlN layers within the SLS. It was found that $delta$-doping at the lower or both upper and lower regions of the AlN layer reduced the resistance, whereas $delta$-doping only at the upper region resulted in increased resistance. In this study, we investigated the effect of $delta$-doping position on the vertical conductivity of the SLS layer by evaluating the electrical characteristics over a temperature range from room temperature to 150 °C. Furthermore, to further suppress the current barrier, the $delta$-doped layer at the upper AlN region was shifted toward the GaN side, where Si is more easily ionized, and Schottky diodes were fabricated for electrical characterization. As a result, the forward current of the sample with the $delta$-doped layer shifted toward the GaN side increased by approximately three times compared with the conventional structure.
Keyword (in Japanese) (See Japanese page) 
(in English) GaN / CAVET / SLS / regrowth / δ-doping / vertical device / Schottky diode /  
Reference Info. IEICE Tech. Rep., vol. 125, no. 257, ED2025-23, pp. 1-4, Nov. 2025.
Paper # ED2025-23 
Date of Issue 2025-11-13 (ED, CPM, LQE) 
ISSN Online edition: ISSN 2432-6380
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All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF ED2025-23 CPM2025-51 LQE2025-47

Conference Information
Committee CPM ED LQE  
Conference Date 2025-11-20 - 2025-11-21 
Place (in Japanese) (See Japanese page) 
Place (in English) TENMONKAN VISION HALL 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To ED 
Conference Code 2025-11-CPM-ED-LQE 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Temperature Characterization of Vertical GaN Devices on Silicon Substrates 
Sub Title (in English)  
Keyword(1) GaN  
Keyword(2) CAVET  
Keyword(3) SLS  
Keyword(4) regrowth  
Keyword(5) δ-doping  
Keyword(6) vertical device  
Keyword(7) Schottky diode  
Keyword(8)  
1st Author's Name Ryoya Aono  
1st Author's Affiliation Nagoya Institute of Technology (Nagoya Inst. of Tech.)
2nd Author's Name Shoma Nakashima  
2nd Author's Affiliation Nagoya Institute of Technology (Nagoya Inst. of Tech.)
3rd Author's Name Tatsuya Kondo  
3rd Author's Affiliation Nagoya Institute of Technology (Nagoya Inst. of Tech.)
4th Author's Name Toshiharu Kubo  
4th Author's Affiliation Nagoya Institute of Technology (Nagoya Inst. of Tech.)
5th Author's Name Takashi Egawa  
5th Author's Affiliation Nagoya Institute of Technology (Nagoya Inst. of Tech.)
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Speaker Author-1 
Date Time 2025-11-20 10:30:00 
Presentation Time 25 minutes 
Registration for ED 
Paper # ED2025-23, CPM2025-51, LQE2025-47 
Volume (vol) vol.125 
Number (no) no.257(ED), no.258(CPM), no.259(LQE) 
Page pp.1-4 
#Pages
Date of Issue 2025-11-13 (ED, CPM, LQE) 


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