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Paper Abstract and Keywords
Presentation 2026-03-13 16:45
[Invited Talk] Graphite sheet embedded in an organic flip-chip package for heat spreading -- NA --
Keiji Matsumoto (IBM-J) SDM2025-78
Abstract (in Japanese) (See Japanese page) 
(in English) We propose and evaluate the embedding of a graphite sheet in an organic substrate for hot-spot heat-spreading in a flip-chip semiconductor package. Graphite sheet has superior thermal characteristics, such as 1500-1700 W/mK (x, y) and 5 -7 W/ mK (z). When it is located near a heat-generating device, it is expected to spread that heat effectively. Embedding a graphite sheet in a heat-generating device may be possible, but the graphite is electrically conductive, and so must be insulated, which is challenging. We therefore propose embedding the graphite sheet in the organic substrate. In this study, the fabrication process and the thermal performances are evaluated. As one example of our thermal simulation results, in a two-chip-stack configuration with a 20 mm x 20 mm top chip with a heat density of 250 W/cm2, centered on a 0.5 mm x 0.5 mm bottom chip, our proposed structure can reduce the maximum chip temperature by 4.8 °C (from 69.2 °C to 64.4 °C).
Keyword (in Japanese) (See Japanese page) 
(in English) organic-substrate-thermal-solutions / Graphite sheet / hot spot heat spreading / / / / /  
Reference Info. IEICE Tech. Rep., vol. 125, no. 399, SDM2025-78, pp. 24-27, March 2026.
Paper # SDM2025-78 
Date of Issue 2026-03-06 (SDM) 
ISSN Online edition: ISSN 2432-6380
Copyright
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reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF SDM2025-78

Conference Information
Committee SDM  
Conference Date 2026-03-13 - 2026-03-13 
Place (in Japanese) (See Japanese page) 
Place (in English)  
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To SDM 
Conference Code 2026-03-SDM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Graphite sheet embedded in an organic flip-chip package for heat spreading 
Sub Title (in English) NA 
Keyword(1) organic-substrate-thermal-solutions  
Keyword(2) Graphite sheet  
Keyword(3) hot spot heat spreading  
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1st Author's Name Keiji Matsumoto  
1st Author's Affiliation IBM-Japan (IBM-J)
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Speaker Author-1 
Date Time 2026-03-13 16:45:00 
Presentation Time 40 minutes 
Registration for SDM 
Paper # SDM2025-78 
Volume (vol) vol.125 
Number (no) no.399 
Page pp.24-27 
#Pages 4 
Date of Issue 2026-03-06 (SDM) 

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