Information: Join today and make your research activities more affordable! Technical workshop participation fees and annual registration fees are available at member rates.
Notice: [Important] Announcement of Changes to Registration Fee Payment and Manuscript Upload Procedures for IEICE Technical Meetings
IEICE Technical Committee Submission System
Conference Paper's Information		 Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2026-05-29 11:50
S-parameter and EVM evaluation on internal EMI shielding using various types of metals for a 6-GHz low-noise amplifier package
Koyu Chinen (GLEX), Ichiko Kinjo (ONCT) EMCJ2026-12
Abstract (in Japanese) (See Japanese page) 
(in English) When a 6GHz LNA was packaged in an ADC mold and covered with a high-SER metal lid, a sharp S21peak at 5.2 GHz was observed. It was confirmed that the internal EM power multiple reflections rotate the total phase by 5π, which was incident on the LNA input stage, causing resonant oscillation at 5.2 GHz. When the Fe-powder-based EM wave shielding (EMWS) sheet was attached to the metal lid bottom, the shielding effect by absorption (SEA) was increased by about 10 dB, and the sharp peak on the S21curve disappeared. This phenomenon was also investigated during the EVM evaluation for 64QAM-OFDM. When the LNA was covered with an ADC lid, the EVM increased by approximately 10 dB due to increased quadrature error (Quad-Err). When the LNA was covered with an ADC/EMWS lid, the EVM and Quad-Err were substantially suppressed.
Keyword (in Japanese) (See Japanese page) 
(in English) Internal EMI shielding / 6GHz-band LNA / Metal powder EM shielding / S-parameter / EVM / / /  
Reference Info. IEICE Tech. Rep., vol. 126, no. 41, EMCJ2026-12, pp. 57-62, May 2026.
Paper # EMCJ2026-12 
Date of Issue 2026-05-21 (EMCJ) 
ISSN Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMCJ2026-12

Conference Information
Committee EMCJ IEE-SPC IEE-EMC  
Conference Date 2026-05-28 - 2026-05-29 
Place (in Japanese) (See Japanese page) 
Place (in English)  
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To EMCJ 
Conference Code 2026-05-EMCJ 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) S-parameter and EVM evaluation on internal EMI shielding using various types of metals for a 6-GHz low-noise amplifier package 
Sub Title (in English)  
Keyword(1) Internal EMI shielding  
Keyword(2) 6GHz-band LNA  
Keyword(3) Metal powder EM shielding  
Keyword(4) S-parameter  
Keyword(5) EVM  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Koyu Chinen  
1st Author's Affiliation GLEX (GLEX)
2nd Author's Name Ichiko Kinjo  
2nd Author's Affiliation National Institute of Technology (ONCT)
3rd Author's Name  
3rd Author's Affiliation ()
4th Author's Name  
4th Author's Affiliation ()
5th Author's Name  
5th Author's Affiliation ()
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
21st Author's Name  
21st Author's Affiliation ()
22nd Author's Name  
22nd Author's Affiliation ()
23rd Author's Name  
23rd Author's Affiliation ()
24th Author's Name  
24th Author's Affiliation ()
25th Author's Name  
25th Author's Affiliation ()
26th Author's Name / /
26th Author's Affiliation ()
()
27th Author's Name / /
27th Author's Affiliation ()
()
28th Author's Name / /
28th Author's Affiliation ()
()
29th Author's Name / /
29th Author's Affiliation ()
()
30th Author's Name / /
30th Author's Affiliation ()
()
31st Author's Name / /
31st Author's Affiliation ()
()
32nd Author's Name / /
32nd Author's Affiliation ()
()
33rd Author's Name / /
33rd Author's Affiliation ()
()
34th Author's Name / /
34th Author's Affiliation ()
()
35th Author's Name / /
35th Author's Affiliation ()
()
36th Author's Name / /
36th Author's Affiliation ()
()
Speaker Author-1 
Date Time 2026-05-29 11:50:00 
Presentation Time 25 minutes 
Registration for EMCJ 
Paper # EMCJ2026-12 
Volume (vol) vol.126 
Number (no) no.41 
Page pp.57-62 
#Pages 6 
Date of Issue 2026-05-21 (EMCJ) 

[Return to Top Page]

[Return to IEICE Web Page]
The Institute of Electronics, Information and Communication Engineers (IEICE), Japan