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Technical Committee on Electromechanical Devices (EMD)  (Searched in: 2013)

Search Results: Keywords 'from:2014-01-31 to:2014-01-31'
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Search Results: Conference Papers
 Conference Papers (Available on Advance Programs)  (Sort by: Date Ascending)
 Results 1 - 4 of 4  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
EMD 2014-01-31
13:35		 Tokyo   An Evaluating Method for Fundamental Dynamical Parameters of Objects on a Printed Circuit Board(4) -- Natural Frequency and Damping Ratio --
Shin-ichi Wada, Keiji Koshida, Hiroaki Kubota (TMC System), Koichiro Sawa (Nippon Inst. of Tech.) EMD2013-136		 Authors have obtained the steady-state responses using theoretical inputs developed by Fourier series and the analytical... [more] EMD2013-136
pp.1-6
EMD 2014-01-31
14:00		 Tokyo   Characteristics of Electric Contact Behavior in Boundary Arc Area -- (III) Phenomenon Just before Break Contact --
Yoshiro Yoshida (ALPS Electric) EMD2013-137		 The voltage ranges in which arc is free at breaking contacts was observed. The real contact area decreases with a rapid ... [more] EMD2013-137
pp.7-10
EMD 2014-01-31
14:25		 Tokyo   Distribution of composition on Ag cathode surfaces heated after occurrence of break arcs
Tomoyuki Atsumi, Junya Sekikawa (Shizuoka Univ.) EMD2013-138		 Break arcs are generated in a DC48V and 12A resistive circuit. Composition distribution on contact surfaces eroded by br... [more] EMD2013-138
pp.11-16
EMD 2014-01-31
14:50		 Tokyo   A Study of Thermal Deformation of box type resin part in Reflow Process
Masayuki Tamura, Toshiyuki Shimoda (JAE) EMD2013-139		 LCP is used many of Insulator(INS) materials. Resins of LCP have the big anisotropy of the coefficient of thermal expans... [more] EMD2013-139
pp.17-22
 Results 1 - 4 of 4  /   
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