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Paper Abstract and Keywords
Presentation 2014-01-31 14:50
A Study of Thermal Deformation of box type resin part in Reflow Process
Masayuki Tamura, Toshiyuki Shimoda (JAE) EMD2013-139
Abstract (in Japanese) (See Japanese page) 
(in English) LCP is used many of Insulator(INS) materials. Resins of LCP have the big anisotropy of the coefficient of thermal expansion(CTE),by orientation of molecules and fibers at the time of injection molding. The residual stress in INS is relaxed at the time of the first heating. Since relaxation of residual stress is thermal deformation, it includes in a CTE. The main factors of the thermal deformation of the INS are an orientation difference of the CTE, and a difference before and after the heating.
The purposes of this study are grasping the characteristic of the box type resin part made from LCP thermal deformation, and reproducing the thermal deformation in analysis.
Keyword (in Japanese) (See Japanese page) 
(in English) SMT / Connector / Reflow / Thermal Deformation / Anisotropy / Orientation / Coefficient of Thermal Expansion / Residual Stress  
Reference Info. IEICE Tech. Rep., vol. 113, no. 425, EMD2013-139, pp. 17-22, Jan. 2014.
Paper # EMD2013-139 
Date of Issue 2014-01-24 (EMD) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMD2013-139

Conference Information
Committee EMD  
Conference Date 2014-01-31 - 2014-01-31 
Place (in Japanese) (See Japanese page) 
Place (in English)  
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To EMD 
Conference Code 2014-01-EMD 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) A Study of Thermal Deformation of box type resin part in Reflow Process 
Sub Title (in English)  
Keyword(1) SMT  
Keyword(2) Connector  
Keyword(3) Reflow  
Keyword(4) Thermal Deformation  
Keyword(5) Anisotropy  
Keyword(6) Orientation  
Keyword(7) Coefficient of Thermal Expansion  
Keyword(8) Residual Stress  
1st Author's Name Masayuki Tamura  
1st Author's Affiliation Japan Aviation Electronics Industry (JAE)
2nd Author's Name Toshiyuki Shimoda  
2nd Author's Affiliation Japan Aviation Electronics Industry (JAE)
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Speaker Author-1 
Date Time 2014-01-31 14:50:00 
Presentation Time 25 minutes 
Registration for EMD 
Paper # EMD2013-139 
Volume (vol) vol.113 
Number (no) no.425 
Page pp.17-22 
#Pages 6 
Date of Issue 2014-01-24 (EMD) 

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