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Technical Committee on Silicon Device and Materials (SDM)  (Searched in: 2018)

Search Results: Keywords 'from:2019-02-07 to:2019-02-07'
[Go to Official SDM Homepage (Japanese)] 
Search Results: Conference Papers
 Conference Papers (Available on Advance Programs)  (Sort by: Date Ascending)
 Results 1 - 8 of 8  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM 2019-02-07
10:05		 Tokyo   [Invited Talk] High-precision Dual Damascene Fabrication Technique
Takashi Hayakawa, Makoto, Syuji Nozawa, Tatsuya Yamaguchi (TEL) 		 [more]
SDM 2019-02-07
10:45		 Tokyo   [Invited Talk] Half pitch 14 nm direct pattering with Nanoimprint lithography
Tetsuro Nakasugi (Toshiba Memory) SDM2018-91		 (To be available after the conference date) [more] SDM2018-91
pp.1-4
SDM 2019-02-07
11:25		 Tokyo   [Invited Talk] Ultrafine 3D Interconnect Technology Using Directed Self-Assembly
Takafumi Fukushima, Murugesan Mariappan, Mitsumasa Koyanagi (Tohoku Univ.) SDM2018-92		 A directed self-assembly (DSA) technology is applied to fabricate ultrafine pitch TSV (Through-Silicon Vias) for ultra-h... [more] SDM2018-92
pp.5-8
SDM 2019-02-07
13:10		 Tokyo   [Invited Talk] Stress Investigation of Annular-Trench-Isolated (ATI) Through Silicon Via (TSV)
Wei Feng, Naoya Watanabe, Haruo Shimamoto, Masahiro Aoyagi, Katsuya Kikuchi (AIST) SDM2018-93		 The methods as parylene substitute of SiO2 as dielectric layer and annular structure lose efficacy for thermal stress re... [more] SDM2018-93
pp.9-14
SDM 2019-02-07
13:50		 Tokyo   [Invited Talk] Grain-Boundary-Crystallinity Dependence of Mechanical Properties and EM Resistance of Electroplated Copper Interconnections
Yifan Luo, Yutaro Nakoshi, Ryota Mizuno, Ken Suzuki, Hideo Miura (Tohoku Univ.) SDM2018-94		  [more] SDM2018-94
pp.15-18
SDM 2019-02-07
14:30		 Tokyo   [Invited Talk] Single Crystal Al Interconnects formed on p-GaN and their Application to GaN FET
Takeshi Harada, Koji Utaka, Yusuke Kand, Katsuhiko Onishi, Keiichi Matsunaga, Masahiro Hikita, Yasuhiro Uemoto (Panasonic) SDM2018-95		  [more] SDM2018-95
pp.19-22
SDM 2019-02-07
15:30		 Tokyo   [Invited Talk] New contact material for advanced CMOS: cluster-preforming-deposited amorphous Si-rich W silicide film
Naoya Okada, Noriyuki Uchida, Shinichi Ogawa, Toshihiko Kanayama (AIST) SDM2018-96		  [more] SDM2018-96
pp.23-26
SDM 2019-02-07
16:10		 Tokyo   [Invited Talk] Fabrication of substrates with smooth Au surface for bonding at room temperature in atmospheric air
Takashi Matsumae, Michitaka Yamamoto, Yuichi Kurashima, Eiji Higurashi, Hideki Takagi (AIST) SDM2018-97		 e electroformed a Cu-based heat spreader with smooth Au thin film for room temperature bonding in atmospheric air. The C... [more] SDM2018-97
pp.27-30
 Results 1 - 8 of 8  /   
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