IEICE Technical Committee Submission System
Conference Schedule
Online Proceedings
[Sign in]
Tech. Rep. Archives
    [Japanese] / [English] 
( Committee/Place/Topics  ) --Press->
( Paper Keywords:  /  Column:Title Auth. Affi. Abst. Keyword ) --Press->

All Technical Committee Conferences  (Searched in: All Years)

Search Results: Conference Papers
 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 6 of 6  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
CPM, ICD 2008-01-18
Tokyo Kikai-Shinko-Kaikan Bldg Assessment Test for Solder Joint Reliability in Mobile Products
Masazumi Amagai, Hiroyuki Sano (TI Japan) CPM2007-144 ICD2007-155
When a mobile phone is dropped, the frequency of occurrence of cracks in solder joints is high. Voids in intermetallic ... [more] CPM2007-144 ICD2007-155
ICD, CPM 2007-01-19
Tokyo Kika-Shinko-Kaikan Bldg. Modeling of Wire Bonding Process for High Performance Device
Eiichi Yamada, Masazumi Amagai (TI Japan)
 [more] CPM2006-143 ICD2006-185
ICD, CPM 2007-01-19
Tokyo Kika-Shinko-Kaikan Bldg. Signal Transmission Guideline in IC Package
Kentaro Takao, Chikara Azuma, Masazumi Amagai (TIJ)
 [more] CPM2006-144 ICD2006-186
ICD, CPM 2005-09-08
Tokyo Kikai-Shinko-Kaikan Bldg. The Study of Silicon Stress for Stacked Die Packages
Kenji Abe, Eiichi Yamada, Yutaka Suzuki, Masazumi Amagai (TI Japan)
 [more] CPM2005-92 ICD2005-102
ICD, CPM 2005-09-08
Tokyo Kikai-Shinko-Kaikan Bldg. The Study of Stress Sensor for Stacked Die Packages
Yutaka Suzuki, Kenji Abe, Eiichi Yamada, , Masazumi Amagai (TI Japan)
 [more] CPM2005-93 ICD2005-103
ICD, CPM 2005-01-27
Tokyo Kikai-Shinko-Kaikan Bldg. The Study of An-Ag-X Lead Free Solders for High Reliability
Masazumi Amagai (TI Japan), Tsukasa Ohnishi, (SMI)
 [more] CPM2004-161 ICD2004-206
 Results 1 - 6 of 6  /   
Choose a download format for default settings. [NEW !!]
Text format pLaTeX format CSV format BibTeX format
Copyright and reproduction : All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)

[Return to Top Page]

[Return to IEICE Web Page]

The Institute of Electronics, Information and Communication Engineers (IEICE), Japan