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Paper Abstract and Keywords
Presentation 2008-01-18 14:15
Assessment Test for Solder Joint Reliability in Mobile Products
Masazumi Amagai, Hiroyuki Sano (TI Japan) CPM2007-144 ICD2007-155
Abstract (in Japanese) (See Japanese page) 
(in English) When a mobile phone is dropped, the frequency of occurrence of cracks in solder joints is high. Voids in intermetallic compound are affected by solder platings. Voids reduce the strength of solder joints and degrades drop test reliability performance significantly. Nano particles included in solder affect the grain size of intermetallic compound and influences drop test reliability performance.
Keyword (in Japanese) (See Japanese page) 
(in English) Drop Test / Intermetallic Compound / Platings / Nano Particles / Lead Free Solder / / /  
Reference Info. IEICE Tech. Rep., vol. 107, no. 425, CPM2007-144, pp. 93-98, Jan. 2008.
Paper # CPM2007-144 
Date of Issue 2008-01-10 (CPM, ICD) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF CPM2007-144 ICD2007-155

Conference Information
Committee CPM ICD  
Conference Date 2008-01-17 - 2008-01-18 
Place (in Japanese) (See Japanese page) 
Place (in English) Kikai-Shinko-Kaikan Bldg 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To CPM 
Conference Code 2008-01-CPM-ICD 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Assessment Test for Solder Joint Reliability in Mobile Products 
Sub Title (in English)  
Keyword(1) Drop Test  
Keyword(2) Intermetallic Compound  
Keyword(3) Platings  
Keyword(4) Nano Particles  
Keyword(5) Lead Free Solder  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Masazumi Amagai  
1st Author's Affiliation Texas Instruments Japan (TI Japan)
2nd Author's Name Hiroyuki Sano  
2nd Author's Affiliation Texas Instruments Japan (TI Japan)
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Speaker Author-1 
Date Time 2008-01-18 14:15:00 
Presentation Time 25 minutes 
Registration for CPM 
Paper # CPM2007-144, ICD2007-155 
Volume (vol) vol.107 
Number (no) no.425(CPM), no.426(ICD) 
Page pp.93-98 
#Pages 6 
Date of Issue 2008-01-10 (CPM, ICD) 

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