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Committee Date Time Place Paper Title / Authors Abstract Paper #
EMD 2009-10-30
17:05
Tokyo   The Influence of Afhesives for Heat Resistant Sealing Characteristic for Relay
Tomohiro Fukuhara (OMRON Corp.) EMD2009-67
In recent years, electronics components has a trend of increasing Surface Mount type because of needs for densely array ... [more] EMD2009-67
pp.51-56
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