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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
EMD |
2008-12-19 13:55 |
Tokyo |
Tamagawa Univ. |
Magnetic Pulse Welding of Various Metal Foils such as Copper, Nickel, Stainless Steel Tomokatsu Aizawa, Keigo Okagawa (Tokyo Metropolitan College. of Industrial Tech.) EMD2008-107 |
This paper describes a foil welding technique by applying pulsed magnetic pressure and its experimental results for vari... [more] |
EMD2008-107 pp.5-10 |
EMD |
2008-01-25 14:25 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Joining Method through Holes between Insulated Conductors by Applying Magnetic Pressure Tomokatsu Aizawa, Keigo Okagawa, Mehardad Kashani (Tokyo Metropolitan College) EMD2007-111 |
This paper describes a new joining method through holes between insulated conductors and its experimental results. When ... [more] |
EMD2007-111 pp.13-16 |
EMD |
2007-12-21 15:55 |
Tokyo |
Japan Aviation Electronics Industry,Limited |
Magnetic Pressure Welding of Copper Foils on Flexible Printed Circuit Boards (2nd Report) Tomokatsu Aizawa (Tokyo Metropolitan College), Kenichi Hanazaki (Yazaki Corporation), Keigo Okagawa (Tokyo Metropolitan College) EMD2007-106 |
This paper describes a new welding technique for copper foils on
flexible printed circuit boards and its experimental r... [more] |
EMD2007-106 pp.35-38 |
EMD |
2006-11-17 15:30 |
Kanagawa |
Fujitsu |
Magnetic Pressure Welding of Copper Foils on Flexible Printed Circuit Boards Tomokatsu Aizawa (College of Industrial Tech.), Kenichi Hanazaki (Yazaki Corporation), Keigo Okagawa (College of Industrial Tech.) |
This paper describes a new welding technique for copper foils on flexible printed circuit boards and its experimental re... [more] |
EMD2006-57 pp.17-20 |
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