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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
EMD |
2009-10-30 17:05 |
Tokyo |
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The Influence of Afhesives for Heat Resistant Sealing Characteristic for Relay Tomohiro Fukuhara (OMRON Corp.) EMD2009-67 |
In recent years, electronics components has a trend of increasing Surface Mount type because of needs for densely array ... [more] |
EMD2009-67 pp.51-56 |
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