|
|
All Technical Committee Conferences (Searched in: All Years)
|
|
Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
|
Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
CPM |
2023-07-31 17:00 |
Hokkaido |
(Primary: On-site, Secondary: Online) |
[Invited Talk]
Progress and future perspective of room-temperature bonding technologies for heterogeneous integration Eiji Higurashi, Kai Takeuchi (Tohoku Univ.) CPM2023-17 |
In recent years, bonding technology has attracted much attention and has become increasingly important to realize high-p... [more] |
CPM2023-17 pp.21-24 |
|
|
|
Copyright and reproduction :
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
|
[Return to Top Page]
[Return to IEICE Web Page]
|