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Paper Abstract and Keywords
Presentation 2023-07-31 17:00
[Invited Talk] Progress and future perspective of room-temperature bonding technologies for heterogeneous integration
Eiji Higurashi, Kai Takeuchi (Tohoku Univ.) CPM2023-17
Abstract (in Japanese) (See Japanese page) 
(in English) In recent years, bonding technology has attracted much attention and has become increasingly important to realize high-performance multifunctional semiconductor devices that feature small size, low power consumption, high thermal dissipation, and high output power and so on. In particular, the room-temperature or low-temperature bonding technology with advanced features such as low thermal damage and low residual stress is today becoming a key technology for heterogeneous integration. This paper focuses on the room-temperature or low-temperature bonding technology and introduces recent research topics in electronic devices.
Keyword (in Japanese) (See Japanese page) 
(in English) Heterogeneous Integration / Room-temperature Bonding / Low-temperature Bonding / Surface Activated Bonding / / / /  
Reference Info. IEICE Tech. Rep., vol. 123, no. 142, CPM2023-17, pp. 21-24, July 2023.
Paper # CPM2023-17 
Date of Issue 2023-07-24 (CPM) 
ISSN Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF CPM2023-17

Conference Information
Committee CPM  
Conference Date 2023-07-31 - 2023-08-01 
Place (in Japanese) (See Japanese page) 
Place (in English)  
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To CPM 
Conference Code 2023-07-CPM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Progress and future perspective of room-temperature bonding technologies for heterogeneous integration 
Sub Title (in English)  
Keyword(1) Heterogeneous Integration  
Keyword(2) Room-temperature Bonding  
Keyword(3) Low-temperature Bonding  
Keyword(4) Surface Activated Bonding  
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1st Author's Name Eiji Higurashi  
1st Author's Affiliation Tohoku University (Tohoku Univ.)
2nd Author's Name Kai Takeuchi  
2nd Author's Affiliation Tohoku University (Tohoku Univ.)
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Speaker Author-1 
Date Time 2023-07-31 17:00:00 
Presentation Time 50 minutes 
Registration for CPM 
Paper # CPM2023-17 
Volume (vol) vol.123 
Number (no) no.142 
Page pp.21-24 
#Pages 4 
Date of Issue 2023-07-24 (CPM) 

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