IEICE Technical Committee Submission System
Conference Schedule
Online Proceedings
[Sign in]
Tech. Rep. Archives
    [Japanese] / [English] 
( Committee/Place/Topics  ) --Press->
 
( Paper Keywords:  /  Column:Title Auth. Affi. Abst. Keyword ) --Press->

All Technical Committee Conferences  (Searched in: All Years)

Search Results: Conference Papers
 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 5 of 5  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
MRIS, ITE-MMS, IEE-MAG 2019-10-18
13:30
Fukuoka Kyushu University (Nishijin Plaza) Spin dynamics in a CoFeB/Pt bilayer with the consideration of heat-induced phenomena
Miyazaki keishi, Yafuso Minoru, Kimura Takashi (Kyushu Univ.) MRIS2019-34
In spin dynamics in ferromagnetic/nonmagnetic bilayers, several phenomena are mixed such as spin torque diode effect cau... [more] MRIS2019-34
pp.113-114
MRIS, ITE-MMS, IEE-MAG 2019-10-18
14:00
Fukuoka Kyushu University (Nishijin Plaza) Observation of nonlinear spin dynamics in an interlayer-coupled ferromagnetic multilayer film
Yafuso Minoru, Keishi Miyazaki, Takashi Kimura (Kyushu Univ.) MRIS2019-36
In magnetic multilayers, the magnetic property is known to be modified by the interlayer coupling in magnetic multilayer... [more] MRIS2019-36
pp.117-118
MRIS, ITE-MMS 2016-10-21
11:35
Fukuoka Nishijin Plaza Efficient generation of thermal spin injection driven by ferromagnetic resonance
Kazuto Yamanoi, Yuki Yokotani, Takashi Kimura (Kyushu Univ.)
We [more]
MRIS, ITE-MMS 2016-10-21
11:55
Fukuoka Nishijin Plaza Indirect detection of thermal spin signal in lateral spin valve
Ginga Uematsu, Tatsuya Nomura, Takashi Kimura (Kyushu Univ.) MR2016-29
Recently, generation of spin current due to heat current has attracted considerable attention. Especially, thermal spin ... [more] MR2016-29
pp.55-57
EMD 2014-01-31
14:50
Tokyo   A Study of Thermal Deformation of box type resin part in Reflow Process
Masayuki Tamura, Toshiyuki Shimoda (JAE) EMD2013-139
LCP is used many of Insulator(INS) materials. Resins of LCP have the big anisotropy of the coefficient of thermal expans... [more] EMD2013-139
pp.17-22
 Results 1 - 5 of 5  /   
Choose a download format for default settings. [NEW !!]
Text format pLaTeX format CSV format BibTeX format
Copyright and reproduction : All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan