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Committee Date Time Place Paper Title / Authors Abstract Paper #
CPM, ICD 2008-01-18
15:20		 Tokyo Kikai-Shinko-Kaikan Bldg A multi-layer wafer-level 5-um-thick Cu wiring technology with photosensitive resin
Katsumi Kikuchi (NEC), Kouji Soejima (NECEL), Yasuhiro Ishii (NEC), Masaya Kawano (NECEL), Masayuki Mizuno, Shintaro Yamamichi (NEC) CPM2007-146 ICD2007-157		 We have successfully developed a multi-layer wafer-level 5-um-thick Cu wiring technology and an embedded on-chip capacit... [more] CPM2007-146 ICD2007-157
pp.105-110
EE 2005-05-13
15:10		 Tokyo Kikai-Shinko-Kaikan Bldg. Development of "SAG PROTECTOR"
Masaki Yamada, Akihiko Iwata, Joji Okada, Yoshihiro Hatakeyama, Yasuhiro Ishii (Mitsubishi Electric Corp.) 		A new voltage sag compensator with a gradationally controlled voltage inverter which exceeds SEMI F47 standard has been ... [more] EE2005-9
pp.47-52
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