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Paper Abstract and Keywords
Presentation 2008-01-18 15:20
A multi-layer wafer-level 5-um-thick Cu wiring technology with photosensitive resin
Katsumi Kikuchi (NEC), Kouji Soejima (NECEL), Yasuhiro Ishii (NEC), Masaya Kawano (NECEL), Masayuki Mizuno, Shintaro Yamamichi (NEC) CPM2007-146 ICD2007-157
Abstract (in Japanese) (See Japanese page) 
(in English) We have successfully developed a multi-layer wafer-level 5-um-thick Cu wiring technology and an embedded on-chip capacitor technology with anodized Al2O3. We observed that our wafer-level Cu wiring technology improved IR-drop five times as small as conventional LSI, and our anodized Al2O3 capacitor technology obtained noise reduction of 20 dBA over 200 MHz. These technologies are believed to provide not only advanced LSIs with stable power supply wirings and higher speed operation, but also connectivity between LSIs and packaging substrates.
Keyword (in Japanese) (See Japanese page) 
(in English) Photosensitive resin / Cu electroplate / Anodization / Alumina / / / /  
Reference Info. IEICE Tech. Rep., vol. 107, no. 425, CPM2007-146, pp. 105-110, Jan. 2008.
Paper # CPM2007-146 
Date of Issue 2008-01-10 (CPM, ICD) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF CPM2007-146 ICD2007-157

Conference Information
Committee CPM ICD  
Conference Date 2008-01-17 - 2008-01-18 
Place (in Japanese) (See Japanese page) 
Place (in English) Kikai-Shinko-Kaikan Bldg 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To CPM 
Conference Code 2008-01-CPM-ICD 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) A multi-layer wafer-level 5-um-thick Cu wiring technology with photosensitive resin 
Sub Title (in English)  
Keyword(1) Photosensitive resin  
Keyword(2) Cu electroplate  
Keyword(3) Anodization  
Keyword(4) Alumina  
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Keyword(6)  
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1st Author's Name Katsumi Kikuchi  
1st Author's Affiliation NEC (NEC)
2nd Author's Name Kouji Soejima  
2nd Author's Affiliation NEC Electronics (NECEL)
3rd Author's Name Yasuhiro Ishii  
3rd Author's Affiliation NEC (NEC)
4th Author's Name Masaya Kawano  
4th Author's Affiliation NEC Electronics (NECEL)
5th Author's Name Masayuki Mizuno  
5th Author's Affiliation NEC (NEC)
6th Author's Name Shintaro Yamamichi  
6th Author's Affiliation NEC (NEC)
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Speaker Author-1 
Date Time 2008-01-18 15:20:00 
Presentation Time 25 minutes 
Registration for CPM 
Paper # CPM2007-146, ICD2007-157 
Volume (vol) vol.107 
Number (no) no.425(CPM), no.426(ICD) 
Page pp.105-110 
#Pages 6 
Date of Issue 2008-01-10 (CPM, ICD) 

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