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Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM 2024-02-21
14:10		 Tokyo Tokyo University-Hongo-Engineering Bldg.4
(Primary: On-site, Secondary: Online)		 [Invited Talk] Optimization of Pre-Bonding Surface for Cu/SiCN Hybrid Bonding
Kohei Nakayama, Kenta Hayama, Yutesu Kamiya, Fmihiro Inoue (YNU) SDM2023-85		 Hybrid bonding is considered the key enabler for advanced chiplet integration, which requires finer pitch vertical conne... [more] SDM2023-85
pp.20-26
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