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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
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Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM 2023-02-07
14:40		 Tokyo Tokyo Univ.
(Primary: On-site, Secondary: Online)		 [Invited Talk] New Approach for Epoxy Mold Compound Slurry in Advanced Packaging Technology
Shogo Arata, Chiaki Noda, Yasuhiro Ichige, Satoyuki Nomura (Resonac), Trianggono Widodo, Nagatoshi Tsunoda, Xavier Brun (Intel) SDM2022-90		 Chemical mechanical polishing (CMP) process has been a part of semiconductor manufacturing processes from front-end to b... [more] SDM2022-90
pp.23-26
SR, SRW
(Joint)		 2015-10-27
09:30		 Tokyo KKE [Technology Exhibit] mmWave Backhaul Link with High Gain Steerable Lens-Array Antenna (LAA)
Maltsev Alexander, Lomayev Artyom, Gagiev Yaroslav (Intel), Danchenko Maxim (UNN) SR2015-61 SRW2015-42		 This paper presents reconfigurable backhaul link operating in 60 GHz band for a number of mmWave small cells. The consid... [more] SR2015-61 SRW2015-42
pp.57-58
SR 2014-01-24
14:50		 Miyagi Tohoku Univ. [Invited Talk] International Standards Development on Dynamic Spectrum Access -- Towards 5G Era --
Takashi Shono (IJKK), Markus Mueck, Reza Arefi (Intel) 		 [more]
SR, RCS, USN, AN
(Joint)		 2008-10-24
09:50		 Okinawa Okinawa industry support center [Panel Discussion] Vision for Heterogeneous Wireless Network
Takashi Shono, Jerry Sydir (Intel) 		 [more]
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