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Committee Date Time Place Paper Title / Authors Abstract Paper #
VLD, HWS, ICD 2024-03-01
14:50		 Okinawa
(Primary: On-site, Secondary: Online)		 Defect Coverage Estimation by Sampling in Testing Power TSV
Koutaro Hachiya, Yudai Kawakami (THU) VLD2023-129 HWS2023-89 ICD2023-118		 As a test for power TSVs (Through Silicon Via) in 3D-IC, a method has been proposed to detect open defects by placing po... [more] VLD2023-129 HWS2023-89 ICD2023-118
pp.157-160
CS, CAS 2020-02-27
11:45		 Kumamoto   Detecting Resistive-Open Defects of Power TSVs in 3D-ICs
Koutaro Hachiya (Teikyo Heisei Univ.), Atsushi Kurokawa (Hirosaki Univ.) CAS2019-104 CS2019-104		 A method is proposed which detects resistive-open defects of power TSVs in PDNs by measuring resistance between power mi... [more] CAS2019-104 CS2019-104
pp.37-41
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