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Committee Date Time Place Paper Title / Authors Abstract Paper #
MSS, CAS, SIP, VLD 2020-06-18
14:25		 Online Online Thermal transient analysis of the heat generation and design of temperature control circuit in three-dimensional stacked chip
Tomoaki Oikawa, Kimiyoshi Usami (Shibaura Inst. of Tech.) CAS2020-9 VLD2020-9 SIP2020-25 MSS2020-9		 As a technology for improving the degree of integration of LSI, there is a three-dimensional stacking technology of LSI ... [more] CAS2020-9 VLD2020-9 SIP2020-25 MSS2020-9
pp.47-52
VLD 2014-03-05
13:00		 Okinawa Okinawa Seinen Kaikan Investigation of thermal monitor for applying to Dynamic Voltage Scaling in SOTB
Tatsuya Wada, Kimiyoshi Usami (Shibaura Inst. of Tech) VLD2013-160		 SOTB (Silicon on Thin Buried Oxide) transistors can operate at high speed in the ultra-low voltage. However, variation i... [more] VLD2013-160
pp.141-146
DC 2012-02-13
16:20		 Tokyo Kikai-Shinko-Kaikan Bldg. Evaluation of a thermal and voltage estimation circuit for field test
Yousuke Miyake, Yasuo Sato, Seiji Kajihara, Kohei Miyase (Kyutech), Yukiya Miura (TMU) DC2011-86		 High dependability is required for an embedded system VLSI. High functionality and high performance of VLSI, due to the ... [more] DC2011-86
pp.61-66
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