IEICE Technical Report

Print edition: ISSN 0913-5685      Online edition: ISSN 2432-6380

Volume 107, Number 46

Electromechanical Devices

Workshop Date : 2007-05-18 / Issue Date : 2007-05-11

[PREV] [NEXT]

[TOP] | [2006] | [2007] | [2008] | [2009] | [2010] | [2011] | [2012] | [Japanese] / [English]

[PROGRAM] [BULK PDF DOWNLOAD]


Table of contents

EMD2007-6
Measuring Mechanical Properties of Sn Plating using Indentation
Daisuke Machihara (JAE)
pp. 1 - 4

EMD2007-7
*
Noboru Wakatsuki, Takanori Kikuchi, Hiroshi Honma, Nobuo Takatsu (Ishinomaki Senshu University)
pp. 5 - 8

EMD2007-8
*
Hiroshi Honma, Takumi Suzuki, Noboru Wakatsuki (Ishinomaki Senshu University)
pp. 9 - 12

EMD2007-9
Development of New Molded Interconnect Device -- Innovative MID technology to realize a micro device --
Mitsuru Kobayashi (Matsushita Electric Works, Ltd.)
pp. 13 - 16

EMD2007-10
A nondestructive PIM evaluation of electrical contacts using antenna near-field
Nobuhiro Kuga, Atsunori Endo (Yokohama Nat'l Univ.)
pp. 17 - 20

EMD2007-11
*
Hiromichi Kubota, Masanari Taniguchi, Shosuke Suzuki, Tasuku Takagi (Tohoku Bunka Gakuen University)
pp. 21 - 24

Note: Each article is a technical report without peer review, and its polished version will be published elsewhere.


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan