Paper Abstract and Keywords |
Presentation |
2007-05-18 15:00
Development of New Molded Interconnect Device
-- Innovative MID technology to realize a micro device -- Mitsuru Kobayashi (Matsushita Electric Works, Ltd.) EMD2007-9 Link to ES Tech. Rep. Archives: EMD2007-9 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
We developed Microscopic Integrated Processing Technology ("MIPTEC" for short) which enabled flip-chip mounting on a molded interconnect device (MID) in thermoplastic resin for the first time in the world.
We realized the resin materials whose CTE (coefficient of thermal expansion) and anisotropy were reduced.
Furthermore, we succeeded in fusing original metallizing processing technology and micro laser-patterning method.
And we applied this technology to ceramics. Ceramics have such a characteristics as ?high heat conductivity ?low CTE
?high heat-resistant ?superior high frequency characteristic. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
MID / surface activation process / laser / thermoplastic resinbare-chip mount / / ceramics / / |
Reference Info. |
IEICE Tech. Rep., vol. 107, no. 46, EMD2007-9, pp. 13-16, May 2007. |
Paper # |
EMD2007-9 |
Date of Issue |
2007-05-11 (EMD) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
Download PDF |
EMD2007-9 Link to ES Tech. Rep. Archives: EMD2007-9 |
Conference Information |
Committee |
EMD |
Conference Date |
2007-05-18 - 2007-05-18 |
Place (in Japanese) |
(See Japanese page) |
Place (in English) |
Ishinomaki Senshu University |
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Paper Information |
Registration To |
EMD |
Conference Code |
2007-05-EMD |
Language |
Japanese |
Title (in Japanese) |
(See Japanese page) |
Sub Title (in Japanese) |
(See Japanese page) |
Title (in English) |
Development of New Molded Interconnect Device |
Sub Title (in English) |
Innovative MID technology to realize a micro device |
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MID |
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surface activation process |
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laser |
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thermoplastic resinbare-chip mount |
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ceramics |
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1st Author's Name |
Mitsuru Kobayashi |
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Matsushita Electric Works, Ltd. (Matsushita Electric Works, Ltd.) |
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Speaker |
Author-1 |
Date Time |
2007-05-18 15:00:00 |
Presentation Time |
25 minutes |
Registration for |
EMD |
Paper # |
EMD2007-9 |
Volume (vol) |
vol.107 |
Number (no) |
no.46 |
Page |
pp.13-16 |
#Pages |
4 |
Date of Issue |
2007-05-11 (EMD) |