IEICE Technical Report

Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380

Ultrasonics

Workshop Date : 2013-02-19 / Issue Date : 2013-02-12

US2012-111
Study on the Defect Imaging for Shallow Part under Concrete Surface using SLDV and Air-coupled Sound Wave -- Examination of Detection of the Exfoliation Defect --
Ryo Akamatsu, Tsuneyoshi Sugimoto (Toin Univ. of Yokohama), Noriyuki Utagawa (Sato Kogyo), Kageyoshi Katakura (Meitoku Eng. Lab.)
pp. 1 - 5

US2012-112
Study on water distribution measurement in soil Using sound vibration -- Study on the estimated precision of the propagation velocity of sound and the soil water measurement during plant cultivation --
Tsuneyoshi Sugimoto, Yutaka Nakagawa, Takashi Shirakawa, Motoaki Sano (Toin Univ. of Yokohama), Motoyoshi Ohaba, Sakae Shibusawa (Tokyo Univ. Agri. and Tech.)
pp. 7 - 12

US2012-113
Non-contact atomizer of droplet by aerial ultrasonic source using two small rectangular transverse vibrating plates.
Miduki Yanagimoto, Hikaru Miura (Nihon Univ.)
pp. 13 - 18

US2012-114
High Temperature Stable Leaky Surface Wave Propagation Properties of SiO2/Electrodes/Rotated Y-X LiTaO3 Structure with Super High Coupling
Kazuhiko Yamanouchi (Tohoku Univ.)
pp. 19 - 24

US2012-115
Sound Wave Propagation from finite element piezo-electric Transducer
Yoshio Udagawa (I.S.L), Osami Kobori (Osaka Sangyo Univ.)
pp. 25 - 31

US2012-116
Imaging of plate thinning shapes using guided waves
Sohichi Hirose, Bin Wang (Tokyo Inst. of Tech.)
pp. 33 - 35

US2012-117
Higher Harmonic Imaging of Anormalities in Metals and Composites
Koichiro Kawashima (USMD/NISRI)
pp. 37 - 42

US2012-118
Reflection phenomena of guided waves in axisymmetric defects and defect size estimations
Hideo Nishino (Tokushima Univ.)
pp. 43 - 47

US2012-119
Ultrasonic Imaging of Internal Voids in Concrete by the FSAP Technique with an Array Transducer in Low Frequency Range
Kazuyuki Nakahata, Gun Kawamura (Ehime Univ.), Sohichi Hirose (Tokyo Inst. of Tech.)
pp. 49 - 52

Note: Each article is a technical report without peer review, and its polished version will be published elsewhere.

The Institute of Electronics, Information and Communication Engineers (IEICE), Japan