Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380
[TOP] | [2014] | [2015] | [2016] | [2017] | [2018] | [2019] | [2020] | [Japanese] / [English]
SDM2017-97
[Invited Talk]
Cluster-Preforming-Deposited Amorphous WSin (n = 12) Insertion Film of Low SBH and High Diffusion Barrier for Direct Cu Contact
Naoya Okada, Noriyuki Uchida, Shinichi Ogawa, Kazuhiko Endo, Toshihiko Kanayama (AIST)
pp. 1 - 4
SDM2017-98
[Invited Talk]
Moisture Barrier Properties of Capping Graphene for Copper Metallization
Kazuyoshi Ueno, Ploybussara Gomasang, Takumi Abe (SIT), Kenji Kawahara (Kyushu Univ.), Yoko Wasai (Horiba Techno), Nguyen Thanh Cuong (NIMS), Nataliya Nabatova-Gabain (Horiba Techno), Hiroki Ago (Kyushu Univ.), Susumu Okada (Univ. Tsukuba)
pp. 5 - 9
SDM2017-99
[Invited Talk]
A Novel Role for SiCN to Suppress H2O Outgas from TEOS oxide films in wafer bonding
Michinari Tetani, Yasunori Morinaga, Masakazu Hamada, Masahiko Takeuchi, Shinji Uya, Hisashi Yano, Naoaki Sato, Susumu Matsumoto (TPSCo)
pp. 11 - 14
SDM2017-100
[Invited Talk]
In-situ Analysis of Corrosion inhibitor behavior of Co surface
Toshiaki Shibta, Tomohiro Kusano, Ken Harada, Kan Takeshita, Yasuhiro Kawase (Mitsubishi Chemical Corp.)
pp. 15 - 18
SDM2017-101
[Invited Talk]
Low cost solder-TSV technology for automobile application
Atsushi Mizutani, Yuki Ohara, Yuki Inagaki, Kazushi Asami (DENSO)
pp. 19 - 23
SDM2017-102
[Invited Talk]
Low temperature Cu-Cu bonding by transient liquid phase sintering of mixed Cu nanoparticles and Sn-Bi eutectic powders
Muhammad Khairi Faiz, Takehiro Yamamoto (Waseda Univ.), Tadatomo Suga (Tokyo Univ.), Tomoyuki Miyashita, Makoto Yoshida (Waseda Univ.)
pp. 25 - 30
SDM2017-103
[Invited Talk]
Next Generation Circuit Fabrication by Molecular Bonding Technology
Akihiko Happoya (Toshiba), Kunio Mori (SCL)
pp. 31 - 34
Note: Each article is a technical report without peer review, and its polished version will be published elsewhere.