Information: Join today and make your research activities more affordable! Technical workshop participation fees and annual registration fees are available at member rates.
Notice: [Important] Announcement of Changes to Registration Fee Payment and Manuscript Upload Procedures for IEICE Technical Meetings
IEICE Technical Committee Submission System
Conference Paper's Information		 Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2007-09-07 14:00
Fabrication of A Planar Power Inductor using Magnetic metal / Polyimide Composite Thick Film
Hayato Shimizu, Tomoki Kashiwagi, Masashi Yoshiike, Masayuki Naoe, Toshiro Sato, Yoshimasa Miura, Kiyohito Yamasawa (Shinshu Univ) EE2007-30
Abstract (in Japanese) (See Japanese page) 
(in English) A planar power inductor with a metallic magnetic particle/polyimide composite thick film and a 1 mm thick Ni-Zn-Cu ferrite substrate has been fabricated and applied to a 1 MHz, 5V-1.5・7A DC-DC converter. Fe-Si-Al alloy and/or Fe based amorphous metallic magnetic particle was used for composite thick film. The fabricated inductor had a 1.4 mm in thickness, 10 mm in size, 130nH in inductance, a small degradation inductance of below 5% at 10A superimposed DC current. 5V-1.5V・7A DC-DC converter with a fabricated planar power inductor exhibited 80 % over in efficiency.
Keyword (in Japanese) (See Japanese page) 
(in English) Composite material / Fe-Al-Si alloy / Fe-B-Si-Cr amorphous / planar inductor / DC-DC converter / / /  
Reference Info. IEICE Tech. Rep., vol. 107, no. 211, EE2007-30, pp. 13-18, Sept. 2007.
Paper # EE2007-30 
Date of Issue 2007-08-31 (EE) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EE2007-30

Conference Information
Committee EE  
Conference Date 2007-09-07 - 2007-09-07 
Place (in Japanese) (See Japanese page) 
Place (in English)  
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To EE 
Conference Code 2007-09-EE 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Fabrication of A Planar Power Inductor using Magnetic metal / Polyimide Composite Thick Film 
Sub Title (in English)  
Keyword(1) Composite material  
Keyword(2) Fe-Al-Si alloy  
Keyword(3) Fe-B-Si-Cr amorphous  
Keyword(4) planar inductor  
Keyword(5) DC-DC converter  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Hayato Shimizu  
1st Author's Affiliation Shinshu University (Shinshu Univ)
2nd Author's Name Tomoki Kashiwagi  
2nd Author's Affiliation Shinshu University (Shinshu Univ)
3rd Author's Name Masashi Yoshiike  
3rd Author's Affiliation Shinshu University (Shinshu Univ)
4th Author's Name Masayuki Naoe  
4th Author's Affiliation Shinshu University (Shinshu Univ)
5th Author's Name Toshiro Sato  
5th Author's Affiliation Shinshu University (Shinshu Univ)
6th Author's Name Yoshimasa Miura  
6th Author's Affiliation Shinshu University (Shinshu Univ)
7th Author's Name Kiyohito Yamasawa  
7th Author's Affiliation Shinshu University (Shinshu Univ)
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
21st Author's Name  
21st Author's Affiliation ()
22nd Author's Name  
22nd Author's Affiliation ()
23rd Author's Name  
23rd Author's Affiliation ()
24th Author's Name  
24th Author's Affiliation ()
25th Author's Name  
25th Author's Affiliation ()
26th Author's Name / /
26th Author's Affiliation ()
()
27th Author's Name / /
27th Author's Affiliation ()
()
28th Author's Name / /
28th Author's Affiliation ()
()
29th Author's Name / /
29th Author's Affiliation ()
()
30th Author's Name / /
30th Author's Affiliation ()
()
31st Author's Name / /
31st Author's Affiliation ()
()
32nd Author's Name / /
32nd Author's Affiliation ()
()
33rd Author's Name / /
33rd Author's Affiliation ()
()
34th Author's Name / /
34th Author's Affiliation ()
()
35th Author's Name / /
35th Author's Affiliation ()
()
36th Author's Name / /
36th Author's Affiliation ()
()
Speaker Author-1 
Date Time 2007-09-07 14:00:00 
Presentation Time 30 minutes 
Registration for EE 
Paper # EE2007-30 
Volume (vol) vol.107 
Number (no) no.211 
Page pp.13-18 
#Pages 6 
Date of Issue 2007-08-31 (EE) 

[Return to Top Page]

[Return to IEICE Web Page]
The Institute of Electronics, Information and Communication Engineers (IEICE), Japan