Information: Join today and make your research activities more affordable! Technical workshop participation fees and annual registration fees are available at member rates.
Notice: [Important] Announcement of Changes to Registration Fee Payment and Manuscript Upload Procedures for IEICE Technical Meetings
IEICE Technical Committee Submission System
Conference Paper's Information		 Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2007-09-14 15:25
Structural analysis as quality evaluation of LSI manufacturing.
Masahito Kajinuma, Akira Mizoguchi, Koichirou Takeuchi (MELCO) R2007-36
Abstract (in Japanese) (See Japanese page) 
(in English) The technology of commercial grade parts, especially semiconductor device, make advance. On the other hand, market share of MIL grade parts are decrease. Generally, high reliability equipments are assembled by MIL grade parts. Furthermore, about 80% of electronic device cost of satellites is high performance electronic devices, for example MPU, memory, etc. If it is possible to use this high performance commercial device to the high reliability equipments, it is possible to decrease a cost and increase performance of the instruments. However, as electronic devices technology advances, parts user pay more time and cost for evaluation of this devices with tester, jig and test program. So, in this letter we describe that quality / reliability evaluation technique for application of commercial parts to high reliability equipments.
Keyword (in Japanese) (See Japanese page) 
(in English) Commercial Grade Parts / MIL Grade Parts / Quality Evaluation / / / / /  
Reference Info. IEICE Tech. Rep., vol. 107, no. 213, R2007-36, pp. 41-44, Sept. 2007.
Paper # R2007-36 
Date of Issue 2007-09-07 (R) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF R2007-36

Conference Information
Committee R  
Conference Date 2007-09-14 - 2007-09-14 
Place (in Japanese) (See Japanese page) 
Place (in English) Kochi Univ. of Technology 
Topics (in Japanese) (See Japanese page) 
Topics (in English) For LSI, evaluation, fault diagnosis, physical analysis and quality 
Paper Information
Registration To R 
Conference Code 2007-09-R 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Structural analysis as quality evaluation of LSI manufacturing. 
Sub Title (in English)  
Keyword(1) Commercial Grade Parts  
Keyword(2) MIL Grade Parts  
Keyword(3) Quality Evaluation  
Keyword(4)  
Keyword(5)  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Masahito Kajinuma  
1st Author's Affiliation Mitsubishi Electric Corporation (MELCO)
2nd Author's Name Akira Mizoguchi  
2nd Author's Affiliation Mitsubishi Electric Corporation (MELCO)
3rd Author's Name Koichirou Takeuchi  
3rd Author's Affiliation Mitsubishi Electric Corporation (MELCO)
4th Author's Name  
4th Author's Affiliation ()
5th Author's Name  
5th Author's Affiliation ()
6th Author's Name  
6th Author's Affiliation ()
7th Author's Name  
7th Author's Affiliation ()
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
21st Author's Name  
21st Author's Affiliation ()
22nd Author's Name  
22nd Author's Affiliation ()
23rd Author's Name  
23rd Author's Affiliation ()
24th Author's Name  
24th Author's Affiliation ()
25th Author's Name  
25th Author's Affiliation ()
26th Author's Name / /
26th Author's Affiliation ()
()
27th Author's Name / /
27th Author's Affiliation ()
()
28th Author's Name / /
28th Author's Affiliation ()
()
29th Author's Name / /
29th Author's Affiliation ()
()
30th Author's Name / /
30th Author's Affiliation ()
()
31st Author's Name / /
31st Author's Affiliation ()
()
32nd Author's Name / /
32nd Author's Affiliation ()
()
33rd Author's Name / /
33rd Author's Affiliation ()
()
34th Author's Name / /
34th Author's Affiliation ()
()
35th Author's Name / /
35th Author's Affiliation ()
()
36th Author's Name / /
36th Author's Affiliation ()
()
Speaker Author-1 
Date Time 2007-09-14 15:25:00 
Presentation Time 25 minutes 
Registration for R 
Paper # R2007-36 
Volume (vol) vol.107 
Number (no) no.213 
Page pp.41-44 
#Pages 4 
Date of Issue 2007-09-07 (R) 

[Return to Top Page]

[Return to IEICE Web Page]
The Institute of Electronics, Information and Communication Engineers (IEICE), Japan