Information: Join today and make your research activities more affordable! Technical workshop participation fees and annual registration fees are available at member rates.
Notice: [Important] Announcement of Changes to Registration Fee Payment and Manuscript Upload Procedures for IEICE Technical Meetings
IEICE Technical Committee Submission System
Conference Paper's Information		 Online Proceedings
[Sign in]
Tech. Rep. Archives
 Go Top Page Go Previous   [Japanese] / [English] 

Paper Abstract and Keywords
Presentation 2007-10-05 16:15
Statistical Evaluation of Characteristics Variability caused by Plasma Processes
Syunichi Watabe, Shigetoshi Sugawa, Kenichi Abe, Takafumi Fujisawa, Naoto Miyamoto, Akinobu Teramoto, Tadahiro Ohmi (Tohoku Univ.) SDM2007-193
Abstract (in Japanese) (See Japanese page) 
(in English) In this paper, we report the statistical evaluation of characteristics degradation in MOSFETs caused by plasma damages which induces the variability of MOSFETs. We demonstrated the suppression of the variability and degradation of MOSFETs characteristics by using microwave excited low plasma damage process.
Keyword (in Japanese) (See Japanese page) 
(in English) MOSFET / TEG(Test Element Group) / statistical evaluation / charge-up damage / / / /  
Reference Info. IEICE Tech. Rep., vol. 107, no. 245, SDM2007-193, pp. 69-72, Oct. 2007.
Paper # SDM2007-193 
Date of Issue 2007-09-27 (SDM) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF SDM2007-193

Conference Information
Committee SDM  
Conference Date 2007-10-04 - 2007-10-05 
Place (in Japanese) (See Japanese page) 
Place (in English) Tohoku Univ. 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Process Science and Novel Process Technologies 
Paper Information
Registration To SDM 
Conference Code 2007-10-SDM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Statistical Evaluation of Characteristics Variability caused by Plasma Processes 
Sub Title (in English)  
Keyword(1) MOSFET  
Keyword(2) TEG(Test Element Group)  
Keyword(3) statistical evaluation  
Keyword(4) charge-up damage  
Keyword(5)  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Syunichi Watabe  
1st Author's Affiliation Tohoku University (Tohoku Univ.)
2nd Author's Name Shigetoshi Sugawa  
2nd Author's Affiliation Tohoku University (Tohoku Univ.)
3rd Author's Name Kenichi Abe  
3rd Author's Affiliation Tohoku University (Tohoku Univ.)
4th Author's Name Takafumi Fujisawa  
4th Author's Affiliation Tohoku University (Tohoku Univ.)
5th Author's Name Naoto Miyamoto  
5th Author's Affiliation Tohoku University (Tohoku Univ.)
6th Author's Name Akinobu Teramoto  
6th Author's Affiliation Tohoku University (Tohoku Univ.)
7th Author's Name Tadahiro Ohmi  
7th Author's Affiliation Tohoku University (Tohoku Univ.)
8th Author's Name  
8th Author's Affiliation ()
9th Author's Name  
9th Author's Affiliation ()
10th Author's Name  
10th Author's Affiliation ()
11th Author's Name  
11th Author's Affiliation ()
12th Author's Name  
12th Author's Affiliation ()
13th Author's Name  
13th Author's Affiliation ()
14th Author's Name  
14th Author's Affiliation ()
15th Author's Name  
15th Author's Affiliation ()
16th Author's Name  
16th Author's Affiliation ()
17th Author's Name  
17th Author's Affiliation ()
18th Author's Name  
18th Author's Affiliation ()
19th Author's Name  
19th Author's Affiliation ()
20th Author's Name  
20th Author's Affiliation ()
21st Author's Name  
21st Author's Affiliation ()
22nd Author's Name  
22nd Author's Affiliation ()
23rd Author's Name  
23rd Author's Affiliation ()
24th Author's Name  
24th Author's Affiliation ()
25th Author's Name  
25th Author's Affiliation ()
26th Author's Name / /
26th Author's Affiliation ()
()
27th Author's Name / /
27th Author's Affiliation ()
()
28th Author's Name / /
28th Author's Affiliation ()
()
29th Author's Name / /
29th Author's Affiliation ()
()
30th Author's Name / /
30th Author's Affiliation ()
()
31st Author's Name / /
31st Author's Affiliation ()
()
32nd Author's Name / /
32nd Author's Affiliation ()
()
33rd Author's Name / /
33rd Author's Affiliation ()
()
34th Author's Name / /
34th Author's Affiliation ()
()
35th Author's Name / /
35th Author's Affiliation ()
()
36th Author's Name / /
36th Author's Affiliation ()
()
Speaker Author-1 
Date Time 2007-10-05 16:15:00 
Presentation Time 25 minutes 
Registration for SDM 
Paper # SDM2007-193 
Volume (vol) vol.107 
Number (no) no.245 
Page pp.69-72 
#Pages 4 
Date of Issue 2007-09-27 (SDM) 

[Return to Top Page]

[Return to IEICE Web Page]
The Institute of Electronics, Information and Communication Engineers (IEICE), Japan