Paper Abstract and Keywords |
Presentation |
2007-12-13 15:45
Ultrasonic Plastic Welding at 2.5MHz using a Surface Acoustic Wave Device Kengo Naruse (Seidensha), Kiyomi Mori, Yuji Watanabe (Takushoku Univ.) US2007-87 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
We are carrying out ultrasonic plastic welding by using a surface acoustic wave (SAW) device. The advantage of usage of a SAW device for welding is as follows: It is known that usage of higher frequencies makes joining time shorter, because ultrasonic absorption coefficient of polymer is proportional to the square of frequency. Furthermore, damages of joined parts can be avoided and positioning accuracy becomes higher, because displacement of vibration of joining tool can be small at higher frequencies. Therefore, it is thought that it is suitable for precise welding. On the other hand, it is very difficult to get wider area of joining part by using conventionally used longitudinal-mode transducer system at higher frequencies. By using the SAW joining system, however, we can get a wider work area on the SAW device. In this study, we joined polyethylene films (width: 2mm,thickness: 0.3 or 0.8mm) by using a 2.5MHz SAW device (joining space: 9.2mm×15.2mm) , measured tensile strength of the joined specimens and observed the joined surfaces by a scanning electron microscope (SEM). |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
Surface Acoustic Wave / Ultrasonic Welding / Polyethylene / Joining / Polymer Material / Ultrasonic / / |
Reference Info. |
IEICE Tech. Rep., vol. 107, no. 376, US2007-87, pp. 29-34, Dec. 2007. |
Paper # |
US2007-87 |
Date of Issue |
2007-12-06 (US) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
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US2007-87 |
Conference Information |
Committee |
US |
Conference Date |
2007-12-13 - 2007-12-13 |
Place (in Japanese) |
(See Japanese page) |
Place (in English) |
Tokyo Inst. of Tech. (Suzukake-dai) |
Topics (in Japanese) |
(See Japanese page) |
Topics (in English) |
High Power Ultrasonics |
Paper Information |
Registration To |
US |
Conference Code |
2007-12-US |
Language |
Japanese |
Title (in Japanese) |
(See Japanese page) |
Sub Title (in Japanese) |
(See Japanese page) |
Title (in English) |
Ultrasonic Plastic Welding at 2.5MHz using a Surface Acoustic Wave Device |
Sub Title (in English) |
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Keyword(1) |
Surface Acoustic Wave |
Keyword(2) |
Ultrasonic Welding |
Keyword(3) |
Polyethylene |
Keyword(4) |
Joining |
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Polymer Material |
Keyword(6) |
Ultrasonic |
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1st Author's Name |
Kengo Naruse |
1st Author's Affiliation |
Seidensha Electronics (Seidensha) |
2nd Author's Name |
Kiyomi Mori |
2nd Author's Affiliation |
Takushoku University (Takushoku Univ.) |
3rd Author's Name |
Yuji Watanabe |
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Takushoku University (Takushoku Univ.) |
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Speaker |
Author-1 |
Date Time |
2007-12-13 15:45:00 |
Presentation Time |
30 minutes |
Registration for |
US |
Paper # |
US2007-87 |
Volume (vol) |
vol.107 |
Number (no) |
no.376 |
Page |
pp.29-34 |
#Pages |
6 |
Date of Issue |
2007-12-06 (US) |
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