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Paper Abstract and Keywords
Presentation 2007-12-13 15:45
Ultrasonic Plastic Welding at 2.5MHz using a Surface Acoustic Wave Device
Kengo Naruse (Seidensha), Kiyomi Mori, Yuji Watanabe (Takushoku Univ.) US2007-87
Abstract (in Japanese) (See Japanese page) 
(in English) We are carrying out ultrasonic plastic welding by using a surface acoustic wave (SAW) device. The advantage of usage of a SAW device for welding is as follows: It is known that usage of higher frequencies makes joining time shorter, because ultrasonic absorption coefficient of polymer is proportional to the square of frequency. Furthermore, damages of joined parts can be avoided and positioning accuracy becomes higher, because displacement of vibration of joining tool can be small at higher frequencies. Therefore, it is thought that it is suitable for precise welding. On the other hand, it is very difficult to get wider area of joining part by using conventionally used longitudinal-mode transducer system at higher frequencies. By using the SAW joining system, however, we can get a wider work area on the SAW device. In this study, we joined polyethylene films (width: 2mm,thickness: 0.3 or 0.8mm) by using a 2.5MHz SAW device (joining space: 9.2mm×15.2mm) , measured tensile strength of the joined specimens and observed the joined surfaces by a scanning electron microscope (SEM).
Keyword (in Japanese) (See Japanese page) 
(in English) Surface Acoustic Wave / Ultrasonic Welding / Polyethylene / Joining / Polymer Material / Ultrasonic / /  
Reference Info. IEICE Tech. Rep., vol. 107, no. 376, US2007-87, pp. 29-34, Dec. 2007.
Paper # US2007-87 
Date of Issue 2007-12-06 (US) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
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reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
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Conference Information
Committee US  
Conference Date 2007-12-13 - 2007-12-13 
Place (in Japanese) (See Japanese page) 
Place (in English) Tokyo Inst. of Tech. (Suzukake-dai) 
Topics (in Japanese) (See Japanese page) 
Topics (in English) High Power Ultrasonics 
Paper Information
Registration To US 
Conference Code 2007-12-US 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Ultrasonic Plastic Welding at 2.5MHz using a Surface Acoustic Wave Device 
Sub Title (in English)  
Keyword(1) Surface Acoustic Wave  
Keyword(2) Ultrasonic Welding  
Keyword(3) Polyethylene  
Keyword(4) Joining  
Keyword(5) Polymer Material  
Keyword(6) Ultrasonic  
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Keyword(8)  
1st Author's Name Kengo Naruse  
1st Author's Affiliation Seidensha Electronics (Seidensha)
2nd Author's Name Kiyomi Mori  
2nd Author's Affiliation Takushoku University (Takushoku Univ.)
3rd Author's Name Yuji Watanabe  
3rd Author's Affiliation Takushoku University (Takushoku Univ.)
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Speaker Author-1 
Date Time 2007-12-13 15:45:00 
Presentation Time 30 minutes 
Registration for US 
Paper # US2007-87 
Volume (vol) vol.107 
Number (no) no.376 
Page pp.29-34 
#Pages
Date of Issue 2007-12-06 (US) 


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