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Paper Abstract and Keywords
Presentation 2008-01-18 15:45
A method of Ultra-fine Pad Interconnection using Electroless Deposition
Tokihiko Yokoshima, Yasuhiro Yamaji, Yuichiro Tamura, Katsuya Kikuchi, Hiroshi Nakagawa, Masahiro Aoyagi (AIST) CPM2007-147 ICD2007-158
Abstract (in Japanese) (See Japanese page) 
(in English) Decrease in bonding temperature and bonding pressure are key challenges for higher interconnection-density packages in recent years. To improve mechanical process such as thermal stress and mechanical damage of the device circuits, we have investigated a method of pad-interconnection using electroless plating. Practical feasibility of this technique was demonstrated by forming interconnection between pads separated by 5 µm and measuring 5 µm in both height and width. This method was applied successfully to interconnecting the pads forming an array with a pitch of 20 µm.
Keyword (in Japanese) (See Japanese page) 
(in English) Pad interconnection / Flip-chip bonding / Low-temperature bonding / Electroless plating / / / /  
Reference Info. IEICE Tech. Rep., vol. 107, no. 425, CPM2007-147, pp. 111-116, Jan. 2008.
Paper # CPM2007-147 
Date of Issue 2008-01-10 (CPM, ICD) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF CPM2007-147 ICD2007-158

Conference Information
Committee CPM ICD  
Conference Date 2008-01-17 - 2008-01-18 
Place (in Japanese) (See Japanese page) 
Place (in English) Kikai-Shinko-Kaikan Bldg 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To CPM 
Conference Code 2008-01-CPM-ICD 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) A method of Ultra-fine Pad Interconnection using Electroless Deposition 
Sub Title (in English)  
Keyword(1) Pad interconnection  
Keyword(2) Flip-chip bonding  
Keyword(3) Low-temperature bonding  
Keyword(4) Electroless plating  
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1st Author's Name Tokihiko Yokoshima  
1st Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
2nd Author's Name Yasuhiro Yamaji  
2nd Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
3rd Author's Name Yuichiro Tamura  
3rd Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
4th Author's Name Katsuya Kikuchi  
4th Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
5th Author's Name Hiroshi Nakagawa  
5th Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
6th Author's Name Masahiro Aoyagi  
6th Author's Affiliation National Institute of Advanced Industrial Science and Technology (AIST)
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Speaker Author-1 
Date Time 2008-01-18 15:45:00 
Presentation Time 25 minutes 
Registration for CPM 
Paper # CPM2007-147, ICD2007-158 
Volume (vol) vol.107 
Number (no) no.425(CPM), no.426(ICD) 
Page pp.111-116 
#Pages 6 
Date of Issue 2008-01-10 (CPM, ICD) 

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