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| Paper Abstract and Keywords | ||
| Presentation | 2008-06-13 15:45 Particle Performance Improvement of Single-Wafer Wet Cleaning for Next Generation Ken-ichi Sano, Katsuhiko Miya, Akira Izumi, Jim Snow, Atsuro Eitoku (Dainippon Screen MFG.)  ED2008-28 Link to ES Tech. Rep. Archives: ED2008-28 |
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| Abstract | (in Japanese) | (See Japanese page) |
| (in English) | 3X-nm particles have been measured in recent years. This study focused on small particle removal and adhesion in a semiconductor wafer cleaning, countermeasures, as well as key major factors. | |
| Keyword | (in Japanese) | (See Japanese page) |
| (in English) | Single-wafer cleaning / Two-fluid spray / particle / / / / / | |
| Reference Info. | IEICE Tech. Rep., vol. 108, no. 87, ED2008-28, pp. 35-40, June 2008. | |
| Paper # | ED2008-28 | |
| Date of Issue | 2008-06-06 (ED) | |
| ISSN | Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 | |
| Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) | |
| Download PDF | ED2008-28 Link to ES Tech. Rep. Archives: ED2008-28 |
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| Conference Information | |
| Committee | ED |
| Conference Date | 2008-06-13 - 2008-06-14 |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | Kanazawa University |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | Process and device technology od semiconductors (surface, interface, reliability, etc.) |
| Paper Information | |
| Registration To | ED |
| Conference Code | 2008-06-ED |
| Language | English (Japanese title is available) |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Particle Performance Improvement of Single-Wafer Wet Cleaning for Next Generation |
| Sub Title (in English) | |
| Keyword(1) | Single-wafer cleaning |
| Keyword(2) | Two-fluid spray |
| Keyword(3) | particle |
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| 1st Author's Name | Ken-ichi Sano |
| 1st Author's Affiliation | Dainippon Screen MFG. Co, LTD. (Dainippon Screen MFG.) |
| 2nd Author's Name | Katsuhiko Miya |
| 2nd Author's Affiliation | Dainippon Screen MFG. Co, LTD. (Dainippon Screen MFG.) |
| 3rd Author's Name | Akira Izumi |
| 3rd Author's Affiliation | Dainippon Screen MFG. Co, LTD. (Dainippon Screen MFG.) |
| 4th Author's Name | Jim Snow |
| 4th Author's Affiliation | Dainippon Screen MFG. Co, LTD. (Dainippon Screen MFG.) |
| 5th Author's Name | Atsuro Eitoku |
| 5th Author's Affiliation | Dainippon Screen MFG. Co, LTD. (Dainippon Screen MFG.) |
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| Speaker | Author-1 |
| Date Time | 2008-06-13 15:45:00 |
| Presentation Time | 25 minutes |
| Registration for | ED |
| Paper # | ED2008-28 |
| Volume (vol) | vol.108 |
| Number (no) | no.87 |
| Page | pp.35-40 |
| #Pages | 6 |
| Date of Issue | 2008-06-06 (ED) |
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