Paper Abstract and Keywords |
Presentation |
2008-07-18 15:05
Impact of Tantalum Composition in TaCx/HfSiON Gate Stack on Device Performance of Aggressively Scaled CMOS Devices with SMT and Strained CESL Masakazu Goto, Kosuke Tatsumura, Shigeru Kawanaka, Kazuaki Nakajima, Reika Ichihara, Yasuhito Yoshimizu, Hiroyuki Onoda, Koji Nagatomo, Toshiyuki Sasaki, Takashi Fukushima, Akiko Nomachi, Seiji Inumiya, Tomonori Aoyama, Masato Koyama, Yoshiaki Toyoshima (Toshiba Corp.) SDM2008-147 ICD2008-57 Link to ES Tech. Rep. Archives: SDM2008-147 ICD2008-57 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
We report TaCx/HfSiON gate stack CMOS device with simplified gate 1st process from the viewpoints of fixed charge generation and its impact on the device performance. Moderate Metal Gate / High-K dielectric (MG/HK) interface reaction is found to be a dominant factor to improve device performance. By optimizing TaCx composition, fixed charge free TaCx/HfSiON device is successfully fabricated. Also, we have demonstrated that the strain effect in deeply scaled devices can be enhanced by eliminating the fixed charges in HfSiON, for the first time. Utilizing Stress Memorization Technique (SMT) and Stress Liner (SL), Lg=35nm high performance TaCx/HfSiON devices is achieved. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
Metal Gate / High-k / TaC / HfSiON / MOSFET / SMT / Stress Liner / |
Reference Info. |
IEICE Tech. Rep., vol. 108, no. 139, SDM2008-147, pp. 109-114, July 2008. |
Paper # |
SDM2008-147 |
Date of Issue |
2008-07-10 (SDM, ICD) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
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SDM2008-147 ICD2008-57 Link to ES Tech. Rep. Archives: SDM2008-147 ICD2008-57 |
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