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Paper Abstract and Keywords
Presentation 2009-03-06 16:35
Growth Law of the Oxide Film Formed on the Tin Plated Contact Surface and Its Contact Resistance Characteristic -- Ellipsometric Study --
Yuya Nabeta, Terutaka Tamai, Yasushi Saitoh, Shigeru Sawada, Kazuo Iida (Mie Univ.), Yasuhiro Hattori (AN Technorogies) EMD2008-146
Abstract (in Japanese) (See Japanese page) 
(in English) Tin plated contacts has been applied widely to electrical contacts of electromechanical devices as well as gold plated contacts. However, the tin plated surfsce covered with oxide film which is fundamentally different from gold plated surfaces. The oxide film prevents the surface from corrosion. When the film is interposed between contact interface, contact resistance increases. It is necessary to break down mechanically to obtain low contact resistance. However, detail study on the oxide film on the tin plated surface was not found in iteratures. Therefore, in the present study, for both 25℃ and 50℃ each other, growth law of the oxide film on the tin plated surface was found by measurement using ellipsometry for exposure to the atmoshere. Morover, the film thickness was identified by TEM. The results well sgreed with results obtained by the ellipsometry. As results, at 25℃, growth of the oxide film showed kinear law until 5nm in the initial stage of the exposure. In the second stage, oxide film indicated 1/4 law unitil 15nm. After this stage, the thickness growth saturated. For 50℃, growth law become increasesd in the initial stage, after this growth law showed same tendency at 25℃. The contact resistance indicated low constant value to 10nm in thickness. This low value is due to conduction mechanisms of thin film. Afer the thickness contact resistance increases to 5Ω.
Keyword (in Japanese) (See Japanese page) 
(in English) tin plating / oxide film / contact electromechanical devices / contact resistance / ellipsometry / SnO / /  
Reference Info. IEICE Tech. Rep., vol. 108, no. 466, EMD2008-146, pp. 49-52, March 2009.
Paper # EMD2008-146 
Date of Issue 2009-02-27 (EMD) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
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All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
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Conference Information
Committee EMD  
Conference Date 2009-03-06 - 2009-03-06 
Place (in Japanese) (See Japanese page) 
Place (in English) Kougakuin Univ. 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Short note (Graduation thesis and master's thesis) 
Paper Information
Registration To EMD 
Conference Code 2009-03-EMD 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Growth Law of the Oxide Film Formed on the Tin Plated Contact Surface and Its Contact Resistance Characteristic 
Sub Title (in English) Ellipsometric Study 
Keyword(1) tin plating  
Keyword(2) oxide film  
Keyword(3) contact electromechanical devices  
Keyword(4) contact resistance  
Keyword(5) ellipsometry  
Keyword(6) SnO  
Keyword(7)  
Keyword(8)  
1st Author's Name Yuya Nabeta  
1st Author's Affiliation Mie University (Mie Univ.)
2nd Author's Name Terutaka Tamai  
2nd Author's Affiliation Mie University (Mie Univ.)
3rd Author's Name Yasushi Saitoh  
3rd Author's Affiliation Mie University (Mie Univ.)
4th Author's Name Shigeru Sawada  
4th Author's Affiliation Mie University (Mie Univ.)
5th Author's Name Kazuo Iida  
5th Author's Affiliation Mie University (Mie Univ.)
6th Author's Name Yasuhiro Hattori  
6th Author's Affiliation AutoNetworks Tchnologise, Ltd. (AN Technorogies)
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Speaker Author-1 
Date Time 2009-03-06 16:35:00 
Presentation Time 15 minutes 
Registration for EMD 
Paper # EMD2008-146 
Volume (vol) vol.108 
Number (no) no.466 
Page pp.49-52 
#Pages
Date of Issue 2009-02-27 (EMD) 


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