Paper Abstract and Keywords |
Presentation |
2009-08-21 16:15
Adhesive Technology of Electronics Devices Tomohiro Fukuhara (OMRON Corp.) EMD2009-56 CPM2009-80 OPE2009-104 LQE2009-63 Link to ES Tech. Rep. Archives: EMD2009-56 CPM2009-80 OPE2009-104 LQE2009-63 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
Relays are used for various purposes, and are demand for high reliability. Especially, Sealing relays are packaged with sealant to prevent from invasion of solder-flux, foreign matters, corrosive gas, etc. It is generally used one-packed epoxy resin adhesives as sealant to fulfill various demanded characteristics for relays. But, in recent years, lead-free soldering makes difficult seal relays because lead-free soldering has higher melting point than lead soldering. Another reason of difficulty of sealing is low adhesion characteristics between epoxy resin adhesives and Liquid Crystal Polymer which is used as base or case of relay. This report makes clear three points about adhesion characteristics between epoxy resin adhesives and Liquid Crystal Polymer. First of all, the mode of destruction of adhesion is cohesive destruction of Liquid Crystal Polymer. Secondary, interaction epoxy resin with Liquid Crystal Polymer depends on hardener of epoxy resin. Thirdly, imidazole-hardener causes large interaction with Liquid Crystal Polymer, and high sealing characteristics for relays. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
Relay / Liquid Crystal Polymer / Epoxy / Imidazole / Adhesion / / / |
Reference Info. |
IEICE Tech. Rep., vol. 109, no. 173, EMD2009-56, pp. 157-162, Aug. 2009. |
Paper # |
EMD2009-56 |
Date of Issue |
2009-08-13 (EMD, CPM, OPE, LQE) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034) |
Download PDF |
EMD2009-56 CPM2009-80 OPE2009-104 LQE2009-63 Link to ES Tech. Rep. Archives: EMD2009-56 CPM2009-80 OPE2009-104 LQE2009-63 |
Conference Information |
Committee |
OPE EMD CPM LQE |
Conference Date |
2009-08-20 - 2009-08-21 |
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(See Japanese page) |
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Paper Information |
Registration To |
EMD |
Conference Code |
2009-08-OPE-EMD-CPM-LQE |
Language |
Japanese |
Title (in Japanese) |
(See Japanese page) |
Sub Title (in Japanese) |
(See Japanese page) |
Title (in English) |
Adhesive Technology of Electronics Devices |
Sub Title (in English) |
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Keyword(1) |
Relay |
Keyword(2) |
Liquid Crystal Polymer |
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Epoxy |
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Imidazole |
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Adhesion |
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1st Author's Name |
Tomohiro Fukuhara |
1st Author's Affiliation |
Omron Corporation (OMRON Corp.) |
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Speaker |
Author-1 |
Date Time |
2009-08-21 16:15:00 |
Presentation Time |
25 minutes |
Registration for |
EMD |
Paper # |
EMD2009-56, CPM2009-80, OPE2009-104, LQE2009-63 |
Volume (vol) |
vol.109 |
Number (no) |
no.173(EMD), no.174(CPM), no.175(OPE), no.176(LQE) |
Page |
pp.157-162 |
#Pages |
6 |
Date of Issue |
2009-08-13 (EMD, CPM, OPE, LQE) |
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