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Paper Abstract and Keywords
Presentation 2009-08-21 16:15
Adhesive Technology of Electronics Devices
Tomohiro Fukuhara (OMRON Corp.) EMD2009-56 CPM2009-80 OPE2009-104 LQE2009-63
Abstract (in Japanese) (See Japanese page) 
(in English) Relays are used for various purposes, and are demand for high reliability. Especially, Sealing relays are packaged with sealant to prevent from invasion of solder-flux, foreign matters, corrosive gas, etc. It is generally used one-packed epoxy resin adhesives as sealant to fulfill various demanded characteristics for relays. But, in recent years, lead-free soldering makes difficult seal relays because lead-free soldering has higher melting point than lead soldering. Another reason of difficulty of sealing is low adhesion characteristics between epoxy resin adhesives and Liquid Crystal Polymer which is used as base or case of relay. This report makes clear three points about adhesion characteristics between epoxy resin adhesives and Liquid Crystal Polymer. First of all, the mode of destruction of adhesion is cohesive destruction of Liquid Crystal Polymer. Secondary, interaction epoxy resin with Liquid Crystal Polymer depends on hardener of epoxy resin. Thirdly, imidazole-hardener causes large interaction with Liquid Crystal Polymer, and high sealing characteristics for relays.
Keyword (in Japanese) (See Japanese page) 
(in English) Relay / Liquid Crystal Polymer / Epoxy / Imidazole / Adhesion / / /  
Reference Info. IEICE Tech. Rep., vol. 109, no. 173, EMD2009-56, pp. 157-162, Aug. 2009.
Paper # EMD2009-56 
Date of Issue 2009-08-13 (EMD, CPM, OPE, LQE) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMD2009-56 CPM2009-80 OPE2009-104 LQE2009-63

Conference Information
Committee OPE EMD CPM LQE  
Conference Date 2009-08-20 - 2009-08-21 
Place (in Japanese) (See Japanese page) 
Place (in English)  
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To EMD 
Conference Code 2009-08-OPE-EMD-CPM-LQE 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Adhesive Technology of Electronics Devices 
Sub Title (in English)  
Keyword(1) Relay  
Keyword(2) Liquid Crystal Polymer  
Keyword(3) Epoxy  
Keyword(4) Imidazole  
Keyword(5) Adhesion  
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1st Author's Name Tomohiro Fukuhara  
1st Author's Affiliation Omron Corporation (OMRON Corp.)
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Speaker Author-1 
Date Time 2009-08-21 16:15:00 
Presentation Time 25 minutes 
Registration for EMD 
Paper # EMD2009-56, CPM2009-80, OPE2009-104, LQE2009-63 
Volume (vol) vol.109 
Number (no) no.173(EMD), no.174(CPM), no.175(OPE), no.176(LQE) 
Page pp.157-162 
#Pages 6 
Date of Issue 2009-08-13 (EMD, CPM, OPE, LQE) 

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