Paper Abstract and Keywords |
Presentation |
2009-10-15 13:30
FEA fabrication technique based on a ion-induced bending (IIB) phenomenon Tomoya Yoshida, Masayoshi Nagao, Takashi Shimizu, Seigo Kanemaru (AIST) ED2009-116 Link to ES Tech. Rep. Archives: ED2009-116 |
Abstract |
(in Japanese) |
(See Japanese page) |
(in English) |
A simple field-emitter-array (FEA) fabrication process based on ion-induced bending (IIB) phenomenon was developed. The IIB technique is a very simple two-step process, involving the formation of cantilever and subsequent ion-irradiation. It can be applied to a wide range of materials deposited by non-specialized sputtering method. And it was found that the bending angle could be controlled by the ion energy and ion dose, irrespective of the film material and the ion species. The procedural advantages of IIB are that it uses small quantities of material and non-specialized equipment. IIB would therefore be compatible with standard CMOS and/or TFT fabrication processes and could produce large-sized FEDs. |
Keyword |
(in Japanese) |
(See Japanese page) |
(in English) |
ion beam irradiation / thin film / stress relaxation / field emitter array / field emission display / / / |
Reference Info. |
IEICE Tech. Rep., vol. 109, no. 230, ED2009-116, pp. 1-6, Oct. 2009. |
Paper # |
ED2009-116 |
Date of Issue |
2009-10-08 (ED) |
ISSN |
Print edition: ISSN 0913-5685 Online edition: ISSN 2432-6380 |
Copyright and reproduction |
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Download PDF |
ED2009-116 Link to ES Tech. Rep. Archives: ED2009-116 |