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Paper Abstract and Keywords
Presentation 2009-11-20 11:20
Development of millimeter wave surface mount package capable of measurement with or without printed circuit boards for secondary packaging
Takashi Shimizu (Utsunomiya Univ.), Hiroshi Nakano (Ammsys/Tokyo Inst. of Tech), Yoshinori Kogami (Utsunomiya Univ.), Yasutake Hirachi (Ammsys/Tokyo Inst. of Tech) MW2009-140
Abstract (in Japanese) (See Japanese page) 
(in English) Generally, it is difficult to measure frequency responses of commercial based surface mount packages (PKG) which mounted a MMIC device without secondary packaging because almost PKG obtain matching when it was mounted on a printed circuit board (PCB) for secondary packaging. Moreover, the frequency range that can be used is up to about 40GHz. In this paper, the millimeter wave surface mount package is proposed which can be measured by RF probes with or without a PCB board for secondary packaging. It was designed by FEM based 3D electromagnetic field simulator and fabricated by the low temperature co-fired ceramics (LTCC) technology. As a result, it has a low transition loss about 0.5dB at 40GHz and has a reflection loss < about -13dB in a frequency range of DC-51GHz.
Keyword (in Japanese) (See Japanese page) 
(in English) Surface mount package / LTCC technology / PCB for secondary packaging / Millimeter-wave / / / /  
Reference Info. IEICE Tech. Rep., vol. 109, no. 291, MW2009-140, pp. 69-74, Nov. 2009.
Paper # MW2009-140 
Date of Issue 2009-11-12 (MW) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
and
reproduction		 All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF MW2009-140

Conference Information
Committee MW  
Conference Date 2009-11-19 - 2009-11-20 
Place (in Japanese) (See Japanese page) 
Place (in English) Tanegashima 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Microwave Technologies 
Paper Information
Registration To MW 
Conference Code 2009-11-MW 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Development of millimeter wave surface mount package capable of measurement with or without printed circuit boards for secondary packaging 
Sub Title (in English)  
Keyword(1) Surface mount package  
Keyword(2) LTCC technology  
Keyword(3) PCB for secondary packaging  
Keyword(4) Millimeter-wave  
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1st Author's Name Takashi Shimizu  
1st Author's Affiliation Utsunomiya Uniersity (Utsunomiya Univ.)
2nd Author's Name Hiroshi Nakano  
2nd Author's Affiliation Ammsys Inc./Tokyo institute of Technology (Ammsys/Tokyo Inst. of Tech)
3rd Author's Name Yoshinori Kogami  
3rd Author's Affiliation Utsunomiya Uniersity (Utsunomiya Univ.)
4th Author's Name Yasutake Hirachi  
4th Author's Affiliation Ammsys Inc./Tokyo institute of Technology (Ammsys/Tokyo Inst. of Tech)
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Speaker Author-1 
Date Time 2009-11-20 11:20:00 
Presentation Time 25 minutes 
Registration for MW 
Paper # MW2009-140 
Volume (vol) vol.109 
Number (no) no.291 
Page pp.69-74 
#Pages 6 
Date of Issue 2009-11-12 (MW) 

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