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Paper Abstract and Keywords
Presentation 2010-02-05 11:20
Feasibility Study of 70nm Pitch Cu/Porous Low-k D/D Integration Featuring EUV Lithography toward 22nm Generation
Naofumi Nakamura, Noriaki Oda, Eiichi Soda, Nobuki Hosoi, Akifumi Gawase, Hajime Aoyama, Y. Tanaka, D. Kawamura, S. Chikaki, M. Shiohara, Nobuaki Tarumi, S. Kondo, Ichiro Mori, S. Saito (SELETE) SDM2009-184
Abstract (in Japanese) (See Japanese page) 
(in English) A feasibility study of 70 nm pitch 2-level dual damascene interconnects featuring EUV lithography is presented. Using Ru barrier metal and scalable porous silica (Po-SiO, k=2.1), a low resistivity below 4.5 uOhmcm and a 13 % reduction in wiring capacitance compared with porous SiOC (k=2.65) was obtained. The predicted circuit- performance using Po-SiO was 10 % higher than that with porous SiOC. The electromigration reliability in 22 nm generation was consistent with the previous generations. The merit of EUV lithography on circuit design was also clarified.
Keyword (in Japanese) (See Japanese page) 
(in English) 70nm pitch wiring / EUV lithography / CF3I etching gas / PVD-Ru / Porous-Silica / / /  
Reference Info. IEICE Tech. Rep., vol. 109, no. 412, SDM2009-184, pp. 13-18, Feb. 2010.
Paper # SDM2009-184 
Date of Issue 2010-01-29 (SDM) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
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reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
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Conference Information
Committee SDM  
Conference Date 2010-02-05 - 2010-02-05 
Place (in Japanese) (See Japanese page) 
Place (in English) Kikai-Shinko-Kaikan Bldg. 
Topics (in Japanese) (See Japanese page) 
Topics (in English)  
Paper Information
Registration To SDM 
Conference Code 2010-02-SDM 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Feasibility Study of 70nm Pitch Cu/Porous Low-k D/D Integration Featuring EUV Lithography toward 22nm Generation 
Sub Title (in English)  
Keyword(1) 70nm pitch wiring  
Keyword(2) EUV lithography  
Keyword(3) CF3I etching gas  
Keyword(4) PVD-Ru  
Keyword(5) Porous-Silica  
Keyword(6)  
Keyword(7)  
Keyword(8)  
1st Author's Name Naofumi Nakamura  
1st Author's Affiliation Semiconductor Leading Edge Technologies, Inc. (SELETE)
2nd Author's Name Noriaki Oda  
2nd Author's Affiliation Semiconductor Leading Edge Technologies, Inc. (SELETE)
3rd Author's Name Eiichi Soda  
3rd Author's Affiliation Semiconductor Leading Edge Technologies, Inc. (SELETE)
4th Author's Name Nobuki Hosoi  
4th Author's Affiliation Semiconductor Leading Edge Technologies, Inc. (SELETE)
5th Author's Name Akifumi Gawase  
5th Author's Affiliation Semiconductor Leading Edge Technologies, Inc. (SELETE)
6th Author's Name Hajime Aoyama  
6th Author's Affiliation Semiconductor Leading Edge Technologies, Inc. (SELETE)
7th Author's Name Y. Tanaka  
7th Author's Affiliation Semiconductor Leading Edge Technologies, Inc. (SELETE)
8th Author's Name D. Kawamura  
8th Author's Affiliation Semiconductor Leading Edge Technologies, Inc. (SELETE)
9th Author's Name S. Chikaki  
9th Author's Affiliation Semiconductor Leading Edge Technologies, Inc. (SELETE)
10th Author's Name M. Shiohara  
10th Author's Affiliation Semiconductor Leading Edge Technologies, Inc. (SELETE)
11th Author's Name Nobuaki Tarumi  
11th Author's Affiliation Semiconductor Leading Edge Technologies, Inc. (SELETE)
12th Author's Name S. Kondo  
12th Author's Affiliation Semiconductor Leading Edge Technologies, Inc. (SELETE)
13th Author's Name Ichiro Mori  
13th Author's Affiliation Semiconductor Leading Edge Technologies, Inc. (SELETE)
14th Author's Name S. Saito  
14th Author's Affiliation Semiconductor Leading Edge Technologies, Inc. (SELETE)
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Speaker Author-1 
Date Time 2010-02-05 11:20:00 
Presentation Time 30 minutes 
Registration for SDM 
Paper # SDM2009-184 
Volume (vol) vol.109 
Number (no) no.412 
Page pp.13-18 
#Pages 6 
Date of Issue 2010-01-29 (SDM) 


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