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Paper Abstract and Keywords
Presentation 2010-06-25 17:10
Magnetic Pulse Welding of Copper Foils without Using Driver
Tomokatsu Aizawa (Tokyo Metropolitan College), Yoshitaka Sugiyama (Yazaki Corp.), Keigo Okagawa (Tokyo Metropolitan College) EMD2010-16 CPM2010-30 OME2010-35 Link to ES Tech. Rep. Archives: EMD2010-16 CPM2010-30 OME2010-35
Abstract (in Japanese) (See Japanese page) 
(in English) This paper describes a copper foil welding technique by using magnetic pulse welding method without drivers and its experimental results. When an impulse current from a capacitor bank passes through a flat one-turn coil, a magnetic flux is suddenly generated around the narrow part (1mm in width) of the coil. Eddy currents are induced in the copper foils (50 μm in thickness) on the narrow part. The foils have a gap between them. The foils can be welded both by the magnetic pressure applied onto them and by Joule heat generated in them. The bank energy required for seam welding of 25mm in length is less than 2kJ.
Keyword (in Japanese) (See Japanese page) 
(in English) Copper foil / Magnetic pulse welding / Magnetic pressure / Flat one-turn coil / Joining interface / / /  
Reference Info. IEICE Tech. Rep., vol. 110, no. 99, EMD2010-16, pp. 43-46, June 2010.
Paper # EMD2010-16 
Date of Issue 2010-06-18 (EMD, CPM, OME) 
ISSN Print edition: ISSN 0913-5685    Online edition: ISSN 2432-6380
Copyright
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reproduction
All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)
Download PDF EMD2010-16 CPM2010-30 OME2010-35 Link to ES Tech. Rep. Archives: EMD2010-16 CPM2010-30 OME2010-35

Conference Information
Committee EMD CPM OME  
Conference Date 2010-06-25 - 2010-06-25 
Place (in Japanese) (See Japanese page) 
Place (in English) Kikai-Shinko-Kaikan Bldg. 
Topics (in Japanese) (See Japanese page) 
Topics (in English) Summer Meeting of materials and devices 
Paper Information
Registration To EMD 
Conference Code 2010-06-EMD-CPM-OME 
Language Japanese 
Title (in Japanese) (See Japanese page) 
Sub Title (in Japanese) (See Japanese page) 
Title (in English) Magnetic Pulse Welding of Copper Foils without Using Driver 
Sub Title (in English)  
Keyword(1) Copper foil  
Keyword(2) Magnetic pulse welding  
Keyword(3) Magnetic pressure  
Keyword(4) Flat one-turn coil  
Keyword(5) Joining interface  
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1st Author's Name Tomokatsu Aizawa  
1st Author's Affiliation Tokyo Metropolitan College of Industrial Technology (Tokyo Metropolitan College)
2nd Author's Name Yoshitaka Sugiyama  
2nd Author's Affiliation Yazaki Corporation (Yazaki Corp.)
3rd Author's Name Keigo Okagawa  
3rd Author's Affiliation Tokyo Metropolitan College of Industrial Technology (Tokyo Metropolitan College)
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Speaker Author-1 
Date Time 2010-06-25 17:10:00 
Presentation Time 25 minutes 
Registration for EMD 
Paper # EMD2010-16, CPM2010-30, OME2010-35 
Volume (vol) vol.110 
Number (no) no.99(EMD), no.100(CPM), no.101(OME) 
Page pp.43-46 
#Pages
Date of Issue 2010-06-18 (EMD, CPM, OME) 


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